Nxp Usa, Inc.

Alexander M Arayata

Mariano Layson Ching, Jr

Allen Marfil Descartin

An integrated circuit (IC) device includes a pressure sensor die, a flexible gel covering a least a pressure-sensing region of the die, and a flexible diaphragm covering the gel. The IC device has encapsulant and a lid that define a cavity above the diaphragm. The lid has an aperture that enables proximate ambient air pressure outside the device to be sensed by the pressure-sensing region through the flexible diaphragm and the flexible gel. The diaphragm protects the gel material from potentially harmful ambient materials. The diaphragm may be a part of the lid.

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Austin, TX, United States of America

Alexander M Arayata