Freescale Semiconductor,inc.

Alexander M Arayata

Stephen Ryan Hooper

Philip H Bowles

William G McDonald

Kai Yun Yow

Jian Wen

A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads.

Lead frame for semiconductor package with enhanced stress relief

A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts.

Growing community of inventors

Gilbert, AZ, United States of America

Alexander M Arayata