Agilent Technologies, Inc.

Alexander Lazar

Gerd Koffmane

Andrew Grieder

High melt balls dispersed on the surface of a ball grid array package in such a manner that the collapse of eutectic solder balls is controlled during reflow heating in order to ensure appropriate solder ball standoff, pitch and coplanarity of the ball grid array package from the substrate or printed circuit board surface to which it is being attached.

High temperature eutectic solder ball attach

A slope generator generates, in response to an input signal, a slope between a first and a second voltage level of an output voltage at an output node. The slope generator comprises a capacitor coupled to the output node, a first current source for providing a first current to the output node, and a second current source for providing a second current to the output node controlled by a first current switch. A control electrode of a first current path of the first current switch is coupled to and controlled by the input signal, a second current path is coupled to the output node, and the first current switch provides the first and the second voltage levels, or corresponding voltage levels derived therefrom, to the output node.

Growing community of inventors

Stuttgart, Germany

Alexander Lazar