Taiwan Semiconductor Manufacturing Comp. Ltd.

National Semiconductor Corporation

Intersil Americas Inc.

Maxim Integrated Products, Inc.

Stmicroelectronics Gmbh

Sgs-thomson Microelectronics Limited

Apple Inc.

Upek, Inc.

Alexander Kalnitsky

Albert M Bergemont

Kong-Beng Thei

Hsiao-Chin Tuan

Chien-Chih Chou

Yi-Huan Chen

Pavel Poplevine

Michael D Church

Dun-Nian Yaung

Shih-Fen Huang

Chun-Ren Cheng

Felix Ying-Kit Tsui

Fu-Jier Fan

Jhy-Jyi Sze

Harry-Hak-Lay Chuang

Chun-Wen Cheng

Chia-Hua Chu

Yimin Huang

Chung-Shi Liu

Jen-Cheng Liu

Alan H Kramer

Chin-Yu Ku

Chia-Shiung Tsai

Ming Chyi Liu

Chun Lin Tsai

Kuo-Ming Wu

Kuo-Chio Liu

Chen-Hua Douglas Yu

Wei Cheng Wu

Hsing-Chih Lin

Yi-Shao Liu

Tien-Wei Chiang

Hau-Yan Lu

Ching-Hua Hsieh

Yuichiro Yamashita

Chen-Jong Wang

Fu-Wei Yao

Ru-Liang Lee

Jen-Chou Tseng

Ru-Yi Su

Chih-Ping Chao

Chia-Wei Hsu

Ming-Fu Tsai

Hung-Jui Kuo

Yeur-Luen Tu

Mirng-Ji Lii

Wei-Cheng Wu

Alan S Roth

Ming-Che Ho

Yi-Wen Wu

Yu-Hung Cheng

Shawn Searles

Hung Cho Wang

Sheng-Huang Huang

Chung-Yi Yu

Fu-Lung Hsueh

Giovanni Gozzini

Cheng-Ta Wu

Ping-Yin Liu

Eric Soenen

Sheng-Chau Chen

Kuei-Sung Chang

Wen-De Wang

Hsin-Hung Chen

Chi-Yuan Shih

Chen-Yi Lee

Yi-Hsien Chang

Hung-Hua Lin

Chih-Wen Hsiung

Yu-Chang Jong

Yi-Chuan Teng

Szu-Yu Wang

Li-Feng Teng

Chen-Hao Chiang

Der-Chyang Yeh

Wen-Ting Chu

Kuo-Chi Tu

Ching-Wen Hsiao

Frank R Bryant

Jui-Cheng Huang

Yao-Wen Chang

Hsun-Chung Kuang

Chi-Ming Chen

Sheng-Hung Shih

Hon-Lin Huang

Tung-Tsun Chen

Sheng-Chan Li

Wen-Chuan Tai

Tzu-Jui Wang

Tzu-Yu Chen

Fusen E Chen

Fei-Lung Lai

Shih-Pei Chou

Jiou-Kang Lee

Hsiang-Fu Chen

Larry Lingjer Wang

Hsin-Ting Huang

Fu-Chen Chang

Chen-Liang Chu

In some embodiments, the present disclosure relates to a semiconductor device comprising a source and drain region arranged within a substrate. A conductive gate is disposed over a doped region of the substrate. A gate dielectric layer is disposed between the source region and the drain region and separates the conductive gate from the doped region. A bottommost surface of the gate dielectric layer is below a topmost surface of the substrate. First and second sidewall spacers are arranged along first and second sides of the conductive gate, respectively. An inner portion of the first sidewall spacer and an inner portion of the second sidewall spacer respectively cover a first and second top surface of the gate dielectric layer. A drain extension region and a source extension region respectively separate the drain region and the source region from the gate dielectric layer.

Recessed gate for an MV device

A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes a substrate having an isolation ring extending in the direction substantially parallel to the surface of the substrate, an active region over the substrate and laterally enclosed by the isolation ring, a seal ring structure over the substrate, the seal ring structure laterally enclosing the active region and including at least a wiring layer and at least a via layer, and an encapsulant material laterally enclosing the seal ring structure.

Semiconductor structure and manufacturing method of the same

The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a method of formation. In some embodiments, the integrated circuit comprises an isolation structure disposed in the boundary region of the substrate. A first polysilicon component is disposed directly on an upper surface of the substrate alongside the isolation structure. A boundary dielectric layer is disposed on the isolation structure. A second polysilicon component is disposed on the sacrifice dielectric layer.

Boundary design for high-voltage integration on HKMG technology

A semiconductor device includes a substrate, an isolation structure, a conductive structure, and a first contact structure. The isolation structure is disposed in the substrate. The conductive structure is disposed on the isolation structure. The conductive structure extends upwards from the isolation structure, in which the first contact structure has a top portion on the conductive structure and a bottom portion in contact with the isolation structure.

Electrical fuse (e-fuse) one-time programmable (OTP) device and manufacturing method thereof

A semiconductor device includes a substrate, a first well, a second well, a metal gate, a poly gate, a source region, and a drain region. The first well and the second well are within the substrate. The metal gate is partially over the first well. The poly gate is over the second well. The poly gate is separated from the metal gate, and a width ratio of the poly gate to the metal gate is in a range from about 0.1 to about 0.2. The source region and the drain region are respectively within the first well and the second well.

Semiconductor device having metal gate and poly gate

In some embodiments, a semiconductor device is provided. The semiconductor device includes a pair of source/drain regions disposed in a semiconductor substrate, where the source/drain regions are laterally spaced. A gate electrode is disposed over the semiconductor substrate between the source/drain regions. Sidewall spacers are disposed over the semiconductor substrate on opposite sides of the gate electrode. A silicide blocking structure is disposed over the sidewalls spacers, where respective sides of the source/drain regions facing the gate electrode are spaced apart from outer sides of the sidewall spacers and are substantially aligned with outer sidewalls of the silicide blocking structure.

Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices

A semiconductor structure includes a substrate and a dielectric material disposed over the substrate. A void is disposed within the dielectric material. A dielectric liner is disposed along inner sidewalls of the dielectric material proximate to the void. An inner surface of the dielectric liner defines an outer extent of the void, and the dielectric liner includes an inner liner layer and an outer liner layer.

Semiconductor structure and manufacturing method thereof

In some embodiments, the present disclosure relates to a semiconductor device that includes a well region with a substrate. A source region and a drain region are arranged within the substrate on opposite sides of the well region. A gate electrode is arranged over the well region, has a bottom surface arranged below a topmost surface of the substrate, and extends between the source and drain regions. A trench isolation structure surrounds the source region, the drain region, and the gate electrode. A gate dielectric structure separates the gate electrode from the well region, the source, region, the drain region, and the trench isolation structure. The gate electrode structure has a central portion and a corner portion. The central portion has a first thickness, and the corner portion has a second thickness that is greater than the first thickness.

Thicker corner of a gate dielectric structure around a recessed gate electrode for an MV device

Various embodiments of the present disclosure are directed towards an integrated chip including a capacitor over a substrate. The capacitor includes a plurality of conductive layers and a plurality of dielectric layers. The plurality of conductive layers and dielectric layers define a base structure and a first protrusion structure extending downward from the base structure towards a bottom surface of the substrate. The first protrusion structure comprises one or more surfaces defining a first cavity. A top of the first cavity is disposed below the base structure.

Trench capacitor profile to decrease substrate warpage

A method includes: receiving a composite substrate including a first region and a second region, the composite substrate comprising a semiconductor substrate and an insulator layer over the semiconductor substrate; bonding a silicon layer to the composite substrate; depositing a capping layer over the silicon layer; forming a trench through the capping layer, the silicon layer and the insulator layer, the trench exposing a surface of the semiconductor substrate in the first region; growing an initial epitaxial layer in the trench; removing the capping layer to form an epitaxial layer from the silicon layer and the initial epitaxial layer; forming a transistor layer over the epitaxial layer, the transistor layer including a first transistor and a second transistor in the first region and the second region, respectively; and forming an interconnect layer over the transistor layer and electrically coupling the first transistor to the second transistor.

The present disclosure relates to an integrated chip. The integrated chip includes a polysilicon layer arranged on an upper surface of a base substrate. A dielectric layer is arranged over the polysilicon layer, and an active semiconductor layer is arranged over the dielectric layer. A semiconductor material is arranged vertically on the upper surface of the base substrate and laterally beside the active semiconductor layer.

Multi-function substrate

In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.

Integrated heater (and related method) to recover degraded piezoelectric device performance

In some embodiments, the present disclosure relates to a high-resistivity silicon-on-insulator (SOI) substrate, including a first polysilicon layer arranged over a semiconductor substrate. A second polysilicon layer is arranged over the first polysilicon layer, and a third polysilicon layer is arranged over the second polysilicon layer. An active semiconductor layer over an insulator layer may be arranged over the third polysilicon layer. The second polysilicon layer has an elevated concentration of oxygen compared to the first and third polysilicon layers.

Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer

Voltage reference circuits are provided. A voltage reference circuit includes a first transistor, a flipped-gate transistor, a first current mirror unit, a second current mirror unit, and an output note. The first transistor is formed by a plurality of second transistors. A gate and a drain of the flipped-gate transistor are coupled to a gate and a drain of each second transistor. The first current mirror unit is configured to provide a first current to the flipped-gate transistor and a mirroring current in response to a bias current. The second current mirror unit is configured to drain a second current from the first transistor in response to the mirroring current. The output node is coupled to a source of each second transistor and the second current mirror unit, and configured to output a reference voltage. Size of the flipped-gate transistor is less than that of the first transistor.

Voltage reference circuit and method for providing reference voltage

An inductor includes a core and a conductive spiral wound around the core. The core includes a buffer layer, an etch stop layer, and a core material layer sequentially stacked. The core material layer includes a ferromagnetic material. A total area of a vertical projection of the core material layer is smaller than an area occupied by the etch stop layer. The vertical projection of the core material layer falls entirely on the etch stop layer. The etch stop layer horizontally protrudes with respect to the core material layer.

Semiconductor device with inductor windings around a core above an encapsulated die

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San Francisco, CA, United States of America

Alexander Kalnitsky