International Business Machines Corporation

Alexander Janta-Polczynski

Paul Francis Fortier

Tymon Barwicz

Stephan L Martel

Jerome Bougie

Darrell Randolph Childers

Nicolas Boyer

Elaine Cyr

Dominique L Demers

Koji Masuda

Patrick Jacques

Vincent Langlois

Jean-Francois Morissette

Systems and methods are provided for obtaining measurements of an integrated circuit chip and a connected carrier to obtain the measurements of the interconnect heights. More specifically, a method is provided that includes defining a top best fit reference plane and a bottom best fit reference plane, and adjusting the top best fit reference and the bottom best fit reference to be superposed to one another. The method further includes calculating first distances between each height measurement for a first set of points and the adjusted top best fit reference plane, and calculating second distances between each height measurement for a second set of points and the adjusted bottom best fit reference plane. The method further includes calculating height values of a gap or interconnect between the first substrate and the second substrate by subtracting the thickness of the first substrate and the second distances from the first distances.

Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect

An optical device includes: a substrate including plural waveguide cores; and an optical component provided on the substrate, the optical component including plural lenses, each of the plural lenses transmitting light passing through one of the corresponding plural waveguide cores on the substrate. The substrate and the optical component are each provided with a positioning structure. The positioning structure includes plural protrusions and plural recesses provided on the substrate and the optical component. Each of the plural recesses accommodates a corresponding one of the plural protrusions, and an outer surface of each of the plural protrusions contacts a positioning surface of a corresponding one of the plural recesses. The positioning surface is a part of an inner surface of each of the plural recesses having accommodated the corresponding one of the plural protrusions to position the plural lenses relative to the substrate.

Microlens array assembling process

A clip connects two ferrules together, without a housing, to form a fiber optic connection. The clip has proximal and distal ends which define, and the clip has arms extending along the longitudinal axis to hold a cable-side ferrule in connection with fixed ferrule connected to a photonic module or die. The arms form an opening through which the cable-side ferrule is passed for connecting to the fixed ferrule. The arms have resilient bends forming a spring that can be resiliently extended along the longitudinal axis. The arms have a contact area at their ends which grasp the end of the cable-sided ferrule. The arms resiliently retract to compress the cable-sided ferrule towards the fixed ferrule with a predetermined force. The clip is positioned with respect to the circuit board using a pick and place system. The clip is not taller than either ferrule portion, enabling a limited vertical clearance.

Connecting mid-board optical modules

An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.

Fiber pigtail assembly with integrated lid enabling optical fiber mobility

A micro-electronic cover has a planar portion sized and dimensioned to be positionable over and cover electronic components that are electrically connected on a board. The cover has a peripheral edge surrounding the planar portion and the electronic components. The peripheral edge connects the planar portion with the board to define a cover interior. The peripheral edge includes a side opening which provides access for passage of a connector part from a exterior to the cover to a position within the cover interior.

Connecting mid-board electronic devices

A component and chip assembly apparatus includes an assembly stage configured to support a chip, the chip including grooves defining a first pitch, the grooves including a first groove opening configured to receive a plurality of optical fibers and to align the plurality of optical fibers. A picker brings a fiber component including a plurality of optical fibers having a second pitch into contact with the chip such that each optical fiber is aligned with a respective groove. At least one of the assembly stage and the picker includes a comb having a plurality of teeth that define individual cavities therebetween, the cavities having a first cavity opening to receive the optical fibers and isolate each optical fiber from one another and pre-align the optical fibers so as to adjust the second pitch to substantially match the first pitch.

Growing community of inventors

Shefford, Canada

Alexander Janta-Polczynski