International Business Machines Corporation

Alexander J Swinton

Richard G Smith

Hormazdyar M Dalal

Hazara Singh Rathore

Paul Stephen McLaughlin

Du Binh Nguyen

Richard Andre Wachnik

Timothy Dooling Sullivan

Kenneth Parker Rodbell

Ronald G Filippi

James Joseph Poulin

Robert D Raviart

A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is deposited by chemical vapor deposition, or by physical vapor deposition in a layer less than about 800 angstroms.

Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity

Sub-quarter-micron copper interconnections with improved

A test layout increases the sample size of electromigration experiments. Through pad sharing, the number of structures tested can be increased, allowing hundreds of identical structures to be tested in a single high temperature oven door.

Multiple device test layout

Growing community of inventors

Hopewell Junction, NY, United States of America

Alexander J Swinton