Micron Technology Incorporated

Aptina Imaging Corporation

Photobit Corporation

Round Rock Research, LLC

Other

Micro Technology, Inc.

Alexander Krymski D. B. a Alexima

Alexander I Krymski

Eric R Fossum

Vladimir Berezin

Barmak Mansoorian

Roger Panicacci

Nikolai E Bock

Christopher Clark

Sandor L Barna

Kwang-Bo (Austin) Cho

Kwang-Bo Cho

Anders Andersson

Daniel A Van Blerkom

Lin Ping Ang

Nick Tu

Abe Kotlyar

Daniel Van Blerkom

Abraham Kotlyar

Eric Hanson

Konstantin Postnikov

An A/D converter suitable for use in a system in which the signal power of noise increases with the signal power of the signal, such as an imaging system, utilizes a variable quantization system for converting analog signals into digital signals. The variable quantization is controlled so that low signal levels the quantization is similar or identical to conventional A/D converters, while the quantization level is increased at higher signal levels. Thus, higher resolution is provided at low signal levels while lower resolution is produced at high signal levels.

Variable quantization ADC for image sensors

A method of operating a CMOS imager is presented wherein a reset transistor source/drain of a first pixel is biased with a first voltage source, a source follower transistor of a second pixel is biased with the same first voltage source, a reset transistor source/drain of the second pixel is biased with a second voltage source, and the first voltage source is dropped to ground during a reset of the second pixel.

Method of operating a CMOS APS pixel sensor

Automatic exposure adjusting device considers the image on a pixel-by-pixel basis. Each pixel is characterized according to its most significant bits. After the pixels are characterized, the number of pixels in any particular group is counted. That counting is compared with thresholds which set whether the image is over exposed, under exposed, and can optionally also determine if the image is seriously over exposed or seriously under exposed. Adjustment of the exposure is carried out to bring the image to a more desired state.

Method of operating an image sensor having a digital exposure circuit

A lock in pinned photodiode photodetector includes a plurality of output ports which are sequentially enabled. Each time when the output port is enabled is considered to be a different bin of time. A specified pattern is sent, and the output bins are investigated to look for that pattern. The time when the pattern is received indicates the time of flightA CMOS active pixel image sensor includes a plurality of pinned photodiode photodetectors that use a common output transistor. In one configuration, the charge from two or more pinned photodiodes may be binned together and applied to the gate of an output transistor.

CMOS active image sensor with common pixel transistors and binning capability

A signal chain for an image sensor is disclosed. The signal chain includes photo sensing elements, pixel readout circuits, and an amplifier. Each pixel readout circuit receives a charge-induced signal and a reset signal from one of the photo sensing elements. The readout circuit computes a difference signal between the charge-induced signal and said reset signal. The difference signal is measured with respect to a reference signal. The amplifier is coupled to the pixel readout circuits, and configured to supply the reference signal during computation of the difference signal. Further, the amplifier amplifies the difference signal when the computation is done.

Low-power signal chain for image sensors

Digital exposure circuit for an image sensor

An A/D converter suitable for use in a system in which the signal power of noise increases with the signal power of the signal, such as an imaging system, utilizes a variable quantization system for converting analog signals into digital signals. The variable quantization is controlled so that at low signal levels the quantization is similar or identical to conventional A/D converters, while the quantization level is increased at higher signal levels. Thus, higher resolution is provided at low signal levels while lower resolution is produced at high signal levels.

A high dynamic range imager operates pixels utilizing at least a short integration period and a long integration period. The pixel reading circuits of the imager are adapted to process pixel signals corresponding to the integration periods in parallel. The pixel signals are converted into digital values in parallel. The digital values are each linear functions of the incident light and therefore suitable for use with conventional color processing algorithms. A pipelined rolling shutter operation may be employed where the short integration period of one row of pixels is performed simultaneously with the long integration period of another row of pixels.

High dynamic range imager with a rolling shutter

A lock in pinned photodiode photodetector includes a plurality of output ports which are sequentially enabled. Each time when the output port is enabled is considered to be a different bin of time. A specified pattern is sent, and the output bins are investigated to look for that pattern. The time when the pattern is received indicates the time of flight.A CMOS active pixel image sensor includes a plurality of pinned photodiode photodetectors that use a common output transistor. In one configuration, the charge from two or more pinned photodiodes may be binned together and applied to the gate of an output transistor.

Pinned photodiode photodetector with common pixel transistors and binning capability

Techniques are disclosed for enhancing the speed at which pixel levels are read out and sampled for processing. A method of processing pixel levels includes clamping a pixel readout line to a voltage level less than a voltage corresponding to a signal sensed by an n-MOS pixel. Subsequently, the pixel readout line is coupled to an output of an n-MOS source-follower and the pixel signal is read out onto the pixel readout line through the n-MOS source-follower. The pixel signal that was read out is passed through a p-MOS source-follower to a processing circuit. Before passing the pixel signal through the p-MOS source-follower to the processing circuit, a capacitive storage node in the processing circuit is clamped to a voltage greater than a signal at an input to the p-MOS source-follower. Subsequently, an output of the p-MOS source-follower is coupled to the processing circuit, and a signal corresponding to the pixel signal is stored by the processing circuit. Similar techniques are provided for reading out and sampling p-MOS pixels.

High speed sampling of signals in active pixel sensors using buffer circuitry

A lock in pinned photodiode photodetector includes a plurality of output ports which are sequentially enabled. Each time when the output port is enabled is considered to be a different bin of time. A specified pattern is sent, and the output bins are investigated to look for that pattern. The time when the pattern is received indicates the time of flight.A CMOS active pixel image sensor includes a plurality of pinned photodiode photodetectors that share buffer transistors. In one configuration, the charge from two or more pinned photodiodes may be binned together and applied to the gate of a shared buffer transistor.

Pinned photodiode photodetector with common buffer transistor and binning capability

An apparatus has a pixel that includes (i) a buffer transistor having an input, (ii) first and second capacitive storage elements each of which selectively can be coupled to the input of the buffer transistor, and (iii) a photosensitive element having an output which selectively can be coupled to the input of the buffer transistor. A readout circuit selectively can be coupled to an output of the buffer transistor. A first signal level, sensed by the photosensitive element, can be stored by the first capacitive storage element, and a second signal level, sensed by the photosensitive element, can be stored by the second capacitive storage element. The first and second signal levels can be read out from the pixel.

Image sensor with pixels having multiple capacitive storage elements

Imaging sensors having dual-port for digital readout to pipeline readout processes of two different groups of pixels.

Semiconductor imaging sensor array devices with dual-port digital readout

An image sensor circuit includes a pixel array, a plurality of column analog-to-digital conversion (ADC) circuits, and at least two memory blocks. Each column ADC circuit is connected to receive analog pixel signals provided from corresponding pixel circuits of the pixel array, and is configured to convert the received analog pixel signals into digital pixel signals. Each memory block is connected to receive digital pixel signals provided from corresponding column ADC circuits of the plurality of column ADC circuits. At least two of the at least two memory blocks are connected to receive digital pixel signals that are provided from corresponding column ADC circuits that are located to a same side of the pixel array. Each memory block of the at least two memory blocks includes a plurality of memory cells, one or more sense amplifiers connected to the memory cells by a readout bus, and a memory controller.

Growing community of inventors

Montrose, CA, United States of America

Alexander I Krymski