Infineon Technologies Ag

Alexander Hulsker

Hendrikus Van Lierop

Jaap Verheggen

A method of monitoring a microelectromechanical systems (MEMS) oscillating structure includes: driving the MEMS oscillating structure configured to oscillate about a rotation axis according to an operating response curve during which the MEMS oscillating structure is in resonance, wherein the MEMS oscillating structure is a non-linear resonator; inducing an oscillation decay of the MEMS oscillating structure at predefined tilt angle such that an oscillation of the MEMS oscillating structure decays from the predefined tilt angle over a decay period; measuring at least one characteristic of the oscillation decay; and determining a mechanical health of the MEMS oscillating structure based on the at least one characteristic of the oscillation decay.

Monitoring of MEMS mirror properties

Systems and methods are provided for monitoring properties of a microelectromechanical systems (MEMS) oscillating structure. A system includes a MEMS oscillating structure configured as a non-linear resonator to oscillate about a rotation axis; a driver configured to generate a driving force for driving the MEMS oscillating structure about the rotation axis according to an operating response curve during which the MEMS oscillating structure is in resonance, the driver further configured to decrease the driving force when the MEMS oscillating structure is at a predefined tilt angle to induce an oscillation decay of the MEMS oscillating structure; a measurement circuit configured to measure an oscillation frequency and a tilt angle amplitude of the MEMS oscillating structure during a decay period; and processing circuitry configured to determine at least one characteristic of the MEMS oscillating structure based on at least one of the measured oscillation frequency and the measured tilt angle amplitude.

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Nijmegen, Netherlands

Alexander Hulsker