Epcos Ag

Tdk Electronics Ag

Epcoa Ag

Alexander Glazunov

Oliver Dernovsek

Georg Kuegerl

Adalbert Feltz

Martin Galler

Michael Schossmann

Markus Puff

Reinhard Gabl

Heinz Florian

Marion Ottlinger

Bernhard Döllgast

Robert Krumphals

Georg Kügerl

Igor Kartashev

Bernhard Doellgast

Denis Orosel

A hard lead zirconate titanate (PZT) ceramic has an ABOstructure with A sites and B sites. The PZT ceramic is doped with Mn and with Nb on the B sites and the ratio Nb/Mn is &#x3c;2. A piezoelectric multilayer component having such a PZT ceramic and also a method for producing a piezoelectric multilayer component are also disclosed.

Hard PZT ceramic, piezoelectric multilayer component and method for producing a piezoelectric multilayer component

A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

Method for producing ceramic multi-layer components

The invention relates to a ceramic material, comprising lead zirconate titanate, which additionally contains K and optionally Cu. The ceramic material can be used in an electroceramic component, for example a piezoelectric actuator. The invention also relates to methods for producing the ceramic material and the electronic component.

Ceramic material, method for producing the ceramic material, and electroceramic component comprising the ceramic material

A method for producing a piezoelectric component is disclosed. In an embodiment, the method includes producing a ceramic precursor material of the general formula PbV&#x2033;BaSr[(TiZr)WRE]O, where RE is a rare earth metal and V&#x2033; is a Pb vacancy, mixing the ceramic precursor material with a sintering aid, forming a stack which includes alternating layers including the ceramic precursor material and a layer including Cu and debindering and sintering the stack thereby forming the piezoelectric component having Cu electrodes and at least one piezoelectric ceramic layer including PbV&#x2033;CuBaSr[(TiZr)WRE]O, where 0&#x2264;x&#x2264;0.035, 0&#x2264;y&#x2264;0.025, 0.42&#x2264;z&#x2264;0.5, 0.0045&#x2264;a&#x2264;0.009, 0.009&#x2264;b&#x2264;0.011, and 2a&#x3e;b, p&#x2264;2a&#x2212;b.

Piezoelectric component and method for producing a piezoelectric component

A piezoelectric multilayer component having a stack of sintered piezoelectric layers and inner electrodes arranged between the piezoelectric layers. A region which has poling cracks is present on the surface of at least one electrode, and the poling cracks are separated from a surface of at least one of the inner electrodes by the region having the poling cracks.

Method for producing a piezoelectric multilayer component and a piezoelectric multilayer component

A method for producing an electronic component includes providing a piezoelectric main body, which is provided with electrodes. A first electric polarization field having a first polarity direction is applied to the piezoelectric main body between the two electrodes and then a second electric polarization field is applied in a second polarity direction, opposite to the first polarity direction, to the piezoelectric main body between the electrodes. The absolute value of the second electric polarization field differs from that of the first electric polarization field.

Method for producing an electronic component

A piezoelectric component has at least one piezoelectric ceramic layer and at least one electrode adjacent the piezoelectric ceramic layer. The piezoelectric ceramic layer has a piezoelectric ceramic material of the general formula PbV&#x2033;CuBaSr[(TiZr)bWRE]O, where 0&#x2266;x&#x2266;0.035, 0&#x2266;y&#x2266;0.025, 0.42&#x2266;z&#x2266;0.5, 0.0045&#x2266;a&#x2266;0.009, 0.009&#x2266;b&#x2266;0.011, 2a&#x3e;b, p&#x2266;2a&#x2212;b, RE is a rare earth metal, and V&#x2033; is a Pb vacancy.

A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material.

A piezo electrical component has a stack of piezo electrical layers arranged over each other and electrode layers arranged therebetween. The stack has at least one first piezo electrical layer having a first piezo electrical charge constant and, directly adjacent thereto, at least one second piezo electrical layer having a second piezo electrical charge constant. The piezo electrical charge constant describes an expansion of the piezo electrical layer perpendicular to an electrical field at a voltage 6 applied to the electrode layers. The first piezo electrical charge constant is different from the second piezo electrical charge constant.

Piezoelectric component

A piezoelectric component includes at least one planned fracture layer for generating and guiding cracks in the component in a controlled manner. The planned fracture layer is disposed between two electrode layers adjacent to each other in the direction of the stack. The distance dof the two electrode layers is greater than the distance dl of two adjacent electrode layers between which no planned fracture layer is provided.

A piezoelectric multilayer component includes a stack of sintered piezoelectric layers and inner electrodes that are arranged there between. A piezoelectric layer includes at least one piezoelectric film. At least one of the piezoelectric films is designed as a weakening film, wherein the thickness of the weakening film is substantially smaller than the thickness of at least one of the other piezoelectric films.

Piezoelectric multilayer component

A piezoelectric component includes a stack of piezoelectric layers arranged one on top of the other and first and second electrode layers arranged therebetween. The stack includes at least one first piezoelectric layer having a first electrical coercive force and directly adjacent thereto at least one second piezoelectric layer having a second electrical coercive force different from the first coercive force.

A piezoelectric multilayer component has a stack of green piezoceramic layers arranged one on top of the other. A first electrode layer is applied onto a piezoceramic layer and contains a first metal. A structured sacrificial layer is applied onto a further piezoceramic layer, adjacent to the first electrode layer in the stacking direction, and contains a higher concentration of the first metal than does the first electrode layer. When the intermediate product is sintered, the first metal diffuses from the structured sacrificial layer to the first electrode layer and in the process leaves cavities which form a weak layer.

A piezoactuator of multilayer design includes piezoelectric layers and electrode layers to form a stack. A predetermined breaking layer for the targeted origination and guiding of cracks is introduced between two adjacent electrode layers. The predetermined breaking layer has a barrier region, in which the formation of continuous electrically conductive paths or the formation of cracks leading through the barrier region is impeded.

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Deutschlandsberg, Austria

Alexander Glazunov