Hypres, Inc.

Seeqc Inc.

Alexander F Kirichenko

Oleg A Mukhanov

Deepnarayan Gupta

Alan M Kadin

Ivan P Nevirkovets

Igor V Vernik

Timur V Filippov

Daniel Yohannes

John Vivalda

Dmitri Kirichenko

Richard Hunt

Mario Renzullo

Saad Sarwana

Dimitri Kirichenko

Igo V Vernik

A superconducting integrated circuit, comprising a plurality of superconducting circuit elements, each having a variation in operating voltage over time; a common power line; and a plurality of bias circuits, each connected to the common power line, and to a respective superconducting circuit element, wherein each respective bias circuit is superconducting during at least one time portion of the operation of a respective superconducting circuit element, and is configured to supply the variation in operating voltage over time to the respective superconducting circuit element.

Low-power biasing networks for superconducting integrated circuits

Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 μA/μm; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.

Materials and methods for fabricating superconducting quantum integrated circuits

A system and method for high-speed, low-power cryogenic computing are presented, comprising ultrafast energy-efficient RSFQ superconducting computing circuits, and hybrid magnetic/superconducting memory arrays and interface circuits, operating together in the same cryogenic environment. An arithmetic logic unit and register file with an ultrafast asynchronous wave-pipelined datapath is also provided. The superconducting circuits may comprise inductive elements fabricated using both a high-inductance layer and a low-inductance layer. The memory cells may comprise superconducting tunnel junctions that incorporate magnetic layers. Alternatively, the memory cells may comprise superconducting spin transfer magnetic devices (such as orthogonal spin transfer and spin-Hall effect devices). Together, these technologies may enable the production of an advanced superconducting computer that operates at clock speeds up to 100 GHz.

System and method for cryogenic hybrid technology computing and memory

Materials and methods are disclosed for fabricating superconducting integrated circuits for quantum computing at millikelvin temperatures, comprising both quantum circuits and classical control circuits, which may be located on the same integrated circuit or on different chips of a multi-chip module. The materials may include components that reduce defect densities and increase quantum coherence times. Multilayer fabrication techniques provide low-power and a path to large scale computing systems. An integrated circuit system for quantum computing is provided, comprising: a substrate; a kinetic inductance layer having a kinetic inductance of at least 5 pH/square; a plurality of stacked planarized superconducting layers and intervening insulating layers, formed into a plurality of Josephson junctions having a critical current of less than 100 &#x3bc;A/&#x3bc;m; and a resistive layer that remains non-superconducting at a temperature below 1 K, configured to damp the plurality of Josephson junctions.

A method for increasing the integration level of superconducting electronic circuits, comprising fabricating a series of planarized electrically conductive layers patterned into wiring, separated by planarized insulating layers, with vias communicating between the conductive layers. Contrary to the standard sequence of patterning from the bottom up, the pattern of vias in at least one insulating layer is formed prior to the pattern of wiring in the underlying conductive layer. This enables a reduction in the number of planarization steps, leading to a fabrication process which is faster and more reliable. In a preferred embodiment, the superconductor is niobium and the insulator is silicon dioxide. This method can provide 10 or more wiring layers in a complex integrated circuit, and is compatible with non-planarized circuits placed above the planarized wiring layers.

Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit

A superconducting multi-bit digital mixer, designed using rapid single flux quantum (RSFQ) logic, for multiplying two independent digital streams, at least one of these comprising a plurality of parallel bit lines, wherein the output is also a similar plurality of bit lines. In a preferred embodiment, one of the digital streams represents a local oscillator signal, and the other digital stream digital radio frequency input from an analog-to-digital converter. The multi-bit mixer comprises an array of bit-slices, with the local oscillator signal generated using shift registers. This multi-bit mixer is suitable for an integrated circuit with application to a broadband digital radio frequency receiver, a digital correlation receiver, or a digital radio frequency transmitter. A synchronous pulse distribution network is used to ensure proper operation at data rates of 20 GHz or above.

Growing community of inventors

Pleasantville, NY, United States of America

Alexander F Kirichenko