Ceramtec Gmbh

Barat Ceramics Gmbh

Alexander Dohn

Alfred Thimm

Claus Peter Kluge

Roland Leneis

Klaus Herrmann

Christian Schnagl

Karl Degelmann

Armin Veitl

Roland Dilsch

Stefan Greger

Axel Schöler

Ewald Sutor

Dietmar Jähnig

Kunibert Reiss

Gerhard Günthner

Kurt Braun

Michael Hemerle

Ulf Herrmann

Alberto Garcia

René Söllner

Jaime Schmitt

Tobias Prüger

To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Multi-layer cooling element

A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Metal coating on ceramic substrates

The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.

Ceramic printed circuit board comprising an al cooling body

Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with Nwhile controlling oxygen at 0-50 ppm O, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with Nwhile keeping the oxygen content at 0-50 ppm O.

Circuit board made of AIN with copper structures

The invention relates to molded functional bodies made of highly thermally conductive materials, namely aluminum nitride, to a method for the production thereof by way of extrusion, and to the use thereof.

Extruded molded functional body made of highly thermally conductive ceramic

In order to supply power and control the power supplied to an LED (), in particular an LED () comprising a ceramic support element (), an LED driver circuit () is designed to regulate the supply current for the LED () in accordance with the temperature of the support element ().

LED driver circuit

Ceramic diode carriers () comprising a ceramic carrier body () integrally connected to ceramic cooling elements () dissipating heat, wherein sintered metallization regions () are disposed as conductors on the surface () of the carrier body (). LEDs () can be fastened to the diode carrier (), the electrical connections thereof being electrically connectable to the conductors. In order to produce luminous bodies from ceramic diode carriers (), at least two identical ceramic diode carriers () are connected into an array.

Array of scalable ceramic diode carriers with LEDs

A lamp for receiving at least one light emitting diode as a light-emitting means, having a bottom part as a supporting element and for feeding the electric connecting wires to a mounting device carrying the at least one light emitting diode, and having a lamp shade. The mounting device is a separate mounting substrate having a breaking strength between 100 and 1,000 MPa and is arranged on the bottom of the device.

Lamp having a variable substrate as a base for a light source

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Memmelsdorf, Germany

Alexander Dohn