Sandisk Technologies Inc.

Alexander Chu

Jixin Yu

Yan Li

Johann Alsmeier

Hiroyuki Ogawa

Fumiaki Toyama

Daxin Mao

Zhenyu Lu

Jong Hak Yuh

Nima Mokhlesi

Yanli Zhang

Man Lung Mui

Seungpil Lee

Tai-Yuan Tseng

Kwang-Ho Kim

Yuki Mizutani

Farookh Moogat

YenLung Li

Qui V Nguyen

Kensuke Yamaguchi

Fanglin Zhang

Kenneth Louie

Anirudh Amarnath

Chun Ge

Yen-Lung Li

Chia-Lin Hsiung

Jong Park

Yanbin An

Lower level metal interconnect structures are formed over a substrate with semiconductor devices thereupon. A semiconductor material layer and an alternating stack of spacer dielectric layers and insulating layers is formed over the lower level metal interconnect structures. An array of memory stack structures is formed through the alternating stack. Trenches are formed through the alternating stack such that a staircase region is located farther away from a threshold lateral distance from the trenches, while neighboring staircase regions are formed within the threshold lateral distance from the trenches. Portions of the spacer dielectric layers proximal to the trenches are replaced with electrically conductive layers, while a remaining portion of the alternating stack is present in the staircase region. At least one through-memory-level via structure can be formed through the remaining portions of the spacer dielectric layers and the insulating layers to provide a vertically conductive path through a memory-level assembly.

Through-memory-level via structures between staircase regions in a three-dimensional memory device and method of making thereof

A semiconductor structure includes a memory-level assembly located over a substrate and including at least one alternating stack and memory stack structures vertically extending through the at least one alternating stack. Each of the at least one an alternating stack includes alternating layers of respective insulating layers and respective electrically conductive layers, and each of the electrically conductive layers in the at least one alternating stack includes a respective opening such that a periphery of a respective spacer dielectric portion located in the opening contacts a sidewall of the respective electrically conductive layers. At least one through-memory-level via structure vertically extends through each of the spacer dielectric portions and the insulating layers.

Within-array through-memory-level via structures and method of making thereof

Apparatuses, systems, and methods are disclosed for three-dimensional non-volatile memory. A stack of word line layers includes word lines for a three-dimensional non-volatile memory array. A stack of word line layers may include a plurality of tiers. Word line switch transistors transfer word line bias voltages to the word lines. Word line contact regions couple word line switch transistors to word lines. A word line contact region includes a stepped structure for a tier of word line layers. A level region separates a word line contact region for a first tier from a word line contact region for a second tier.

Word line contact regions for three-dimensional non-volatile memory

A three dimensional stacked non-volatile memory device comprises alternating dielectric layers and conductive layers in a stack, a plurality of bit lines below the stack, and a plurality of source lines above the stack. There is a separate source line for each bit line. Each source lines is connected to a different subset of NAND strings. Each bit line is connected to a different subset of NAND strings. Multiple data states are verified concurrently. Reading is performed sequentially for the data states. The data states are programmed concurrently with memory cells being programmed to lower data states having their programming slowed by applying appropriate source line voltages and bit line voltages.

Three dimensional non-volatile memory with separate source lines

Systems and methods for reducing the area and improving the performance of a non-volatile memory array are described. The non-volatile memory array may comprise a 3D NAND memory array that includes vertical NAND strings that are arranged orthogonal to a substrate. A vertical NAND string may include floating gate memory cell transistors or charge trap memory cell transistors. Sensing circuitry for sensing the programmed data states of memory cell transistors within the vertical NAND strings may be positioned underneath the 3D NAND memory array and connections from bit lines positioned above the 3D NAND memory array may be made using vertical connections extending though the 3D NAND memory array or through memory breaks within the 3D NAND memory array.

Architecture for CMOS under array

Sense circuits in a memory device can be pre-charged to different levels in a sensing process to reduce the amount of time used for sensing. During sensing of first and second memory cells, a control circuit pre-charges first and second sense circuits to first and second voltages, respectively. The first and second sense circuits are associated with the first and second memory cells, respectively. Also, during the sensing, a control gate voltage is applied to the first and second memory cells. The control circuit allows the first and second sense node voltages to discharge in a common discharge period and the cells are sensed using a common trip condition. The first and second memory cells are therefore subject to different concurrent verify tests.

Memory device which performs verify operations using different sense node pre-charge voltages and a common discharge period

In a non-volatile memory system, a voltage generator provides a voltage to a gate of a voltage-setting transistor which is used in a sense circuit to set an initial voltage at a sense node. At the end of a sense period, a final voltage of the sense node is compared to a trip point, which is the threshold voltage of a voltage-sensing transistor. To account for temperature variations and manufacturing process variations, the voltage generator includes a transistor which is matched to the voltage-setting transistor, and a transistor which is matched to the voltage-sensing transistor. As a result, a voltage swing between the initial voltage and the trip point is constant, even as the initial voltage and trip point vary. In a particular implementation, the voltage generator uses a cascode current mirror circuit, and receives a reference current from a band gap voltage circuit.

Voltage generator to compensate sense amplifier trip point over temperature in non-volatile memory

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San Francisco, CA, United States of America

Alexander Chu