Wentworth Laboratories Limited

United Parcel Service of America, Inc.

Other

Intel Corporation

Take-along Lifts LLC

Alexander Brandorff

Steven L Smith

John W Sussmeier

Robert L Rogers

William H Fulton

Pasquale Nifo Sarrapochiello

Catherine Susan Brandorff

William P Pardee

Gerard Michael Campbell

Methods of fabricating a plurality of carbon nanotube-bundle probes on a substrate are disclosed. In some embodiments, the method includes the following: providing a substrate having a top surface and a bottom surface; forming an array of electrically conductive pads on the top surface, the array of electrically conductive pads being formed to mirror an array of pads on an integrated circuit that is to be tested; applying a catalyst for promoting growth of carbon nanotubes on each of the array of electrically conductive pads; heating the substrate in a carbon-rich environment thereby growing nanotubes extending upwardly from each of the array of electrically conductive pads and above the top surface of the substrate thereby forming a plurality of carbon nanotube-bundle probes extending upwardly above the top surface of the substrate; and capping each of the plurality of carbon nanotube-bundle probes with an electrically conductive material.

Methods of fabricating probe cards including nanotubes

A probe card assembly for testing circuit boards is disclosed. In some embodiments, the assembly includes the following: a multi-layered dielectric plate aligned with an integrated circuit, the integrated circuit having on its surface a first plurality of electrical contacts arranged in a pattern, the dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching the first plurality of electrical contacts; a nanotube interposer interposed between the dielectric plate and the integrated circuit, the nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on the integrated circuit and the dielectric plate; and a plurality of vertical probes arrayed upon the nanotube interposer and joined with the nanotubes, the vertical probes making electrical contact with the first plurality of electrical contacts and the second plurality of electrical contacts via the nanotubes.

Probe card assemblies and probe pins including carbon nanotubes

An improved patient transfer and toileting sling comprising an additional flapfabric and adjustment strap. The additional fabric and adjusting means allows for enhanced security during transfers and can be easily and quickly removed to facilitate access to patient's clothing during toileting. Adjustment bucklesallow the sling to be secured and fitted around a patient's bottom for enhanced comfort and security during transfers. They can also be used to secure the additional flapfabric up and out of the way during toileting to allow for improved access to a patient's clothing.

Invalid toileting safety sling

Methods and systems for inserting and replacing swaged probe pins in a lower die portion of a head having an array of micro-holes for receiving the probe pins are disclosed. The methods and systems include the following: swaged probe pins including substantially cylindrical ends and a swaged center portion; and an assembly aid film including an array of slotted holes, each of the slotted holes including a substantially round portion for receiving the substantially cylindrical ends of the swaged probe pins and slot portions for receiving the swaged center portion of the swaged probe pins. The array of slotted holes is configured to properly align the swaged probe pins with the array of micro-holes.

Die design with integrated assembly aid

An upper die portion of a die head for aligning probes having different offsets in a first array of first micro-holes formed in a lower die portion of the die head. The upper die portion includes a spacer portion and a first assembly aid film. The spacer portion includes first and second surfaces. The first surface contacts the lower die portion. The first assembly aid film is attached with the second surface and has a second array of second micro-holes for receiving the probes having different offsets. The second micro-holes include at least a first micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a first offset and at least a second micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a second offset that is not the same as the first offset.

Multi-offset die head

An upper die portion of a die head for aligning probe pins in first array of first micro-holes formed in lower die portion of the die head, which generally includes a spacer portion and is adapted to contact lower die portion is typically positioned between second surface and support frame and includes a second array of second micro-holes adapted to receive probe pins generally is in contact or close proximity to first assembly aid film and has a third array of third micro-holes adapted to receive probe pins and third array of third micro-holes are patterned to align with one another but are both offset with first array of first micro-holes by approximately the lateral distance between probe tip and probe head.

An upper die portion () of a die head for aligning probe pins () in first array of first micro-holes () formed in lower die portion () of the die head, which generally includes a spacer portion (), a support frame (), and first and second assembly aid films () and (), respectively. Spacer portion () is adapted to contact lower die portion (). First assembly aid film () is typically positioned between second surface () and support frame () and includes a second array of second micro-holes () adapted to receive probe pins (). Second assembly aid film () generally is in contact or close proximity to first assembly aid film () and has a third array of third micro-holes () adapted to receive probe pins (). Second array of second micro-holes () and third array of third micro-holes () are patterned to align with one another but are both offset with first array of first micro-holes () by approximately the lateral distance between probe tip () and probe head ().

A probe card assembly that compensates for differing rates of thermal expansion is disclosed herein. The assembly is comprised of a multi-layered dielectric plate interposed between a probe head and a printed circuit board. The printed circuit board has arrayed upon its surface a first plurality of electrical contacts arranged in a pattern. The dielectric plate has a second plurality of electrical contacts arranged in a pattern matching the first plurality of contacts. A planarizing interposer is interposed between the plate and the printed circuit board and has a pattern of holes matching the pattern of electrical contacts on the printed circuit board and plate. The assembly further includes a plurality of electrical connectors disposed within each of the holes arrayed in a pattern upon the planarizing interposer a plurality conductive bumps or fuzz buttons making electrical contact with the first and second plurality of electrical contacts.

Planarizing interposer for thermal compensation of a probe card

An improved portable patient transfer device comprising a small wheeled base having a vertically disposed telescoping lifting column extending upwardly therefrom. A patient support means extends from the column to support the patient. A crank, accessible to both patient and attendant, is used to raise and lower the lifting column for transfer between surfaces with different heights, such as beds, wheelchairs, and car seats. The lift my be closed and temporarily attached to a wheelchair for convenient transport with a patient. The lift is small and lightweight and may be easily transported and stored. The lift is further economical to manufacture.

Compact portable patient lift

A weight sensor generates a load signal representative of the weight of the object as the object approaches, tips over, and leaves the downstream end of a conveyor. A support mechanism preferably provides balancing of the load upon the weight sensor. The weight of the object is determined from the load signal which is preferably adjusted to compensate for various mechanical effects using signals generated by an inclinometer for measuring the angle of inclination of the conveyor, a mechanism for measuring the speed of the object upon the conveyor, and/or an accelerometer for generating signals characteristic of the vibration of the conveyor.

Apparatus for weighing objects

An apparatus for illuminating and imaging a surface includes a two-dimensional array of LEDs for providing uniform illumination to the surface, the LEDs being mounted on a planar surface with a centrally defined aperture, and a CCD-based camera with appropriate lensing for obtaining an image of the illuminated surface and providing a signal representative of that obtained image to a processing unit, the CCD-based camera lensing being disposed through the centrally defined aperture in the planar surface of the LED array, and the LED array and CCD-camera lensing being disposed inside an opaque shroud.

Method and apparatus for illumination and imaging of a surface using 2-D

A method and apparatus for weighing an object in which the object is moved to, and tipped over, a tip point. A signal representative of the weight of the object is generated as the object is tipped over the tip point. The apparatus may include a conveyor for moving the object toward the tip point, which may be supported by a load sensor that generates the signals representative of the object weight.

Method and apparatus for weighing rigid and non-rigid objects

Robotic hand includes retractable paddles for supporting an article and a vertically-movable top paddle for engaging an upper surface of the article. The top paddle is mounted on an upper free end of a band of sheet-like material, which may be extended above the top surface of a housing of the robotic hand. Inflatable bladders in the retractable paddles have a relatively high coefficient of friction, and the top surface of the paddles has relatively low coefficient of friction. A force sensor may be provided in the lower surface of the top paddles.

Growing community of inventors

New Milford, CT, United States of America

Alexander Brandorff