Heraeus Deutschland Gmbh & Co Kg

Alexander Brand

Wolfgang Schmitt

Michael Schäfer

Sebastian Fritzsche

Thomas Krebs

Andreas Steffen Klein

Andreas Hinrich

Michael Benedikt

Martin Bleifuss

Tanja Dickel

Markus Koenig

Daniel Hanselmann

A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use

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Elsenfeld, Germany

Alexander Brand