International Business Machines Corporation

Alexander Boyd

Kenneth Skene Murray

Stuart P Lees

William French

Brian L Robertson

Briand L Robertson

Solder particles,are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate,. The contacts,are coated with a layer of flux,. A pick up head,is positioned in a reservoir,of solder particles,and particles are attracted to the apertures in the end,of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head,is positioned adjacent the substrate,and the particles,released. The particles,stick to the flux,coated on the contacts,. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs,and the reliefs reflowed again to attach the chip onto the contacts

Solder particle deposition

Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 and particles are attracted to the apertures in the end 213 of the head. The apertures have an arrangement corresponding to the footprint of the metallized contacts on the substrate. The head 211 is positioned adjacent the substrate 301 and the particles 220 released. The particles 220 stick to the flux 303 coated on the contacts 302. The particles are reflowed, leveled and again coated with flux. An integrated circuit chip is then placed on the leveled reliefs 501 and the reliefs reflowed again to attach the chip onto the contacts 302.

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Largs, United Kingdom

Alexander Boyd