Infineon Technologies Ag

Alexander Benedix

Wolfgang Ruf

Reinhard Dueregger

Stefan Dankowski

Bernd Klehn

Reinhard Düregger

Georg Braun

Helmut Fischer

Robert Hermann

Roland Barth

Reinhard D&uuml;regger

Sebastian Kuhne

Stephan Grosse

Helmut Schneider

Johann Pfeiffer

Kazimierz Szczypinski

Henning Hartmann

Disclosed is a test method for testing a data store having an integrated test data compression circuit where the data store has a memory cell array with a multiplicity of addressable memory cells, read/write amplifiers for reading and writing data to the memory cell via an internal data bus in the data store and a test data compression circuit which compresses test data sequences, which are each read serially from the memory cell array, with stored reference test data sequences in order to produce a respective indicator data item which indicates whether at least one data error has occurred in the test data sequence which has been read.

Testing a data store using an external test unit for generating test sequence and receiving compressed test results

A memory system for network broadcasting applications, such as video/audio applications, has at least one memory which is divided into a plurality of addressable memory units, which have a respective dedicated output for interchanging data. The inputs of a matrix switch are connected to a respective output of a different memory unit. The matrix switch is operated such that a plurality of the memory units are connected to its output in a sequential order. A first sequence of memory units and a second sequence of memory units are connected to its output independently. This results in a memory system, which can handle a number of requests to the same memory at staggered times. The interaction of the individual memory units with the matrix switch allows a high data throughput and a short access time.

Memory system for network broadcasting applications and method for operating the same

A configuration for executing data processing processes has an operating system and various system resources that are accessed by the operating system using an access strategy for the execution of system processes. When there are different applications, different access strategies to the system resources are used. A method is also provided for determining the optimum access strategy to the system resources.

Method for determining the optimum access strategy

A method for replacing defective memory cells of a random access memory device of a data processing apparatus, in which, during the operation of the data processing apparatus, a defective memory cell is replaced by a replacement memory cell in the random access memory device by using a control instruction.

Method for replacing defective memory cells in data processing apparatus

A test configuration that includes a device and a method for testing the device in which test results determined during the testing of the device are stored in a memory in the device. In this way, the test results are connected with the device and available at any time for later evaluations.

Method for testing a device and a test configuration including a device with a test memory

To be able to test a plurality of identical semiconductor circuit devices in a particularly rapid yet reliable manner, a test method includes carrying out the tests in parallel and substantially simultaneously on the plurality of semiconductor circuit devices and driver lines&#x2014;used in the process&#x2014;of a test device to the semiconductor circuit devices simultaneously and jointly for all the semiconductor circuit devices. In such a case, test results are read from a plurality of input/output channels in compressed form. Furthermore, as an alternative or in addition thereto, the semiconductor circuit devices to be tested are disposed and connected up in at least one stack.

Method for testing semiconductor circuit devices

The data processing system has configurable components, which each have a configuration register for storing configuration data. A serial bus couples the configuration registers to a non-volatile memory so that a serial transmission of data from the non-volatile memory to the configuration registers is made possible, for example when the system is booted up. The system already functions even if complex bus systems, such as extensively parallel high-speed buses, for example, are not yet available in a configuration process of the system. The system can be used in all data processing systems, in particular in mobile applications.

Data processing system having configurable components

A method is provided for storing data in a memory device having memory cells arranged in memory cell rows and memory cell columns. The method can include a step for providing redundant memory cells in the memory device. The method can also include a step for localizing defective cells. Further, the method can include a step of accessing the redundant memory cells by means of a predeterminable access mode. The method can also include a step of bypassing defective memory cells of the memory device in a manner dependent on the predeterminable access mode during operation of the memory device for accessing redundant memory cells and for replacement by redundant memory cells. Further, the method can include a step for providing redundant memory cells for storing additional information describing a defect correction.

Method for storing data in a memory device with the possibility of access to redundant memory cells

The present invention relates to an interconnect structure for an integrated circuit ( ) having a first interconnect (B ; B &prime;; B &Prime;), which is composed of a plurality of interconnect sections (A -A ; A &prime;-A &prime;; A &Prime;-A &Prime;) lying in a first and a second interconnect plane (M , M ); and a second interconnect (B ; B &prime;; B &Prime;), which runs adjacent to the first interconnect (B ; B &prime;; B &Prime;) and which is composed of a plurality of interconnect sections (A -A ; A &prime;-A &prime;; A &Prime;-A &Prime;) lying in the first and second interconnect planes (M , M ); the first and second interconnects (B ; B &prime;; B &Prime;; B ; B &prime;; B &Prime;) being offset with respect to one another in the longitudinal direction in such a way that the interconnect sections (A , A , A ; A &prime;, A &prime;, A &prime;; A &Prime;, A &Prime;) of the first interconnect (B ; B &prime;; B &Prime;) which lie in the first interconnect plane (M ) run at least in sections beside the interconnect sections (A , A ; A &prime;; A &prime;; A &Prime;, A &Prime;) of the second interconnect (B ; B &prime;; B &Prime;) which lie in the second interconnection plane (M ), and that the interconnect sections (A , A , A ; A &prime;, A &prime;, A &prime;; A &Prime;, A &Prime;) of the first interconnect (B ; B &prime;; B &Prime;) which lie in the second interconnect plane (M ) run at least in sections beside the interconnect sections (A , A , A ; A &prime;, A &prime;, A &prime;; A &Prime;) of the second interconnect (B ; B &prime;; B &Prime;) which lie in the first interconnect plane (M ). The invention also provides a corresponding fabrication method.

Interconnect structure for an integrated circuit and corresponding fabrication method

An interface unit and a printed circuit board configuration includes at least two interface units for linking conventional commercially available packages of integrated circuits on a printed circuit board in a more flexible and compact way, which allows compact high-performance electronic circuits to be produced on a small surface area and with low development expenditure.

Connection of packaged integrated memory chips to a printed circuit board

A temperature sensor is integrated together with an integrated circuit on a chip, the sensor delivering a temperature-dependent measuring signal or at least emitting a signal when the chip temperature falls below a specific prescribed value. For such an eventuality, the chip includes a special circuit device thereon, by which a current flow is generated through a provided structure of electrical conductors that keeps the temperature of the integrated circuit above a prescribed minimum temperature.

Integrated circuit with temperature sensor and method for heating the circuit

A method for integrating imperfect semiconductor memory devices having functional and defective memory cells into a data processing apparatus. The defective memory cells are assigned defect addresses or defect address ranges. Before a memory access of the data processing apparatus is carried out, the address of the memory access is compared with the defect addresses or defect address ranges and is recoded in the event of correspondence.

Method for integrating imperfect semiconductor memory devices in data processing apparatus

According to one embodiment, a dynamic memory is provided. The dynamic memory can include a memory matrix having a plurality of memory cells arranged in rows and columns. The memory cells in a row can be connected by in each case one of a plurality of word lines. The memory cells in a column can be connected by in each case one of a plurality of bit lines. The dynamic memory can also include a sense amplifier for reading data from the memory cells via the plurality of bit lines. Further, the dynamic memory can include a row address decoder and a column address decoder for generating memory-internal address in a manner dependent on a memory-external address signal. The dynamic memory can also include a sequence control device for cyclically generating refresh addresses for carrying for carrying out a refresh operation of the memory cells.

Dynamic memory device and method for controlling such a device

A semiconductor memory is described which has a clock input, a signal input, a data output, a measuring device, a control circuit, and a latency. The latency elapses between the activation of the signal input and the availability of the data to be read at the data output. A clock signal is fed to the clock input. On the basis of the clock signal, the measuring device determines a value for the latency and the control circuit configures the semiconductor memory with the determined value for the operation of the semiconductor memory.

Semiconductor memory and method for operating the semiconductor memory

An integrated memory has a memory cell array, which is subdivided into a plurality of separate segments. A first and a second local word line in different segments together form a common global word line. The global word line is decoded via a row decoder. The first and second local word lines are connected to a column decoder in such a way that they can be decoded individually and segment by segment in a manner dependent on a column address. The memory thus allows fast and current-saving activation of a word line.

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Munich, Germany

Alexander Benedix