Raytheon Company

Alexander B Brailovsky

Angelo M Puzella

Philip M Henault

A printed circuit board comprises a support structure, a conductive layer operably coupled to the support structure, a mask structure formed on the conductive layer, and a cover layer. The conductive layer comprises first and second portions of conductive material separated by a gap that defines a spacing between the first and second portions that does not contain conductive material. The mask structure defines first and second regions on the conductive layer. The first region is enclosed by a first boundary defined by the mask structure and includes the gap. The second region lies outside of the first boundary. The cover layer is sized to fit within the first region and comprises a laminatible insulating material that flows within the first region during lamination. During lamination, the first boundary prevents the laminatible insulating material from flowing into the second region, and the laminatible insulating material flows to fill the gap.

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Irvine, CA, United States of America

Alexander B Brailovsky