Harman International Industries, Inc.

Alex Tzinares

Valod Noshadi

David Jia

Homero Garza

Homero L Garza

The present disclosure relates to electronic devices and configurations. In one embodiment, an electronic device includes a plurality of circuit boards and a plurality of chassis enclosures. Each of the plurality of circuit boards is separately housed by a chassis enclosure. Each chassis enclosure includes a front housing and a back housing, the front housing and back housing configured to retain a circuit board, and at least one heat dissipation element. The plurality of chassis enclosures are mounted to provide an air gap for heat dissipation between each chassis enclosures. Each chassis enclosure electrically shields a retained circuit board.

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Ann Arbor, MI, United States of America

Alex Tzinares