Xerox Corporation

Lucent Technologies Inc.

Other

Agere Systems Inc.

Alex T Tran

Joel A Kubby

Jingkuang Chen

Peter M Gulvin

Decai Sun

Chuang-Chia Lin

Dustin Wade Carr

Eric Peeters

Andrew J Zosel

Christopher L Chua

Philip D Floyd

Ross D Bringans

Bruce R Scharf

Patrick Yasuo Maeda

Jungsang Kim

Jun Ma

Timofei Nikita Kroupenkine

Kathleen A Feinberg

Victor Alexander Lifton

Ho Bun Chan

Anatoli Olkhovets

Yi Su

Fuqian Yang

Michael Patrick Schlax

Christopher John Frye

Joseph J Vuillemin

Nena Liakopoulos

A portable waveguide sensor having one or more gratings. In one embodiment, the sensor has a waveguide, wherein a plurality of grooves imprinted onto the waveguide form a Bragg grating. The surface of the grooves has a functional layer adapted to bind a substance of interest, e.g., a biological pathogen. When the pathogen binds to the functional layer, the binding shifts the spectral reflection band corresponding to the Bragg grating such that a probe light previously reflected by the grating now passes through the grating, thereby indicating the presence of the pathogen. In another embodiment, the sensor has a Mach-Zehnder interferometer (MZI), one arm of which has a resonator formed by two Bragg gratings. The surface of the resonator between the gratings has a functional layer whereas the Bragg gratings themselves do not have such a layer.

Optical substance analyzer

The invention relates to devices and methods for detecting a ligand in a liquid, based on deflection of one or more microscopic cantilevers. Each cantilever has an optical waveguide fixed thereto or integral therewith. Deflection of the cantilever is detected by assessing coupling of light between the optical waveguide on the cantilever and an optical waveguide fixed distally thereto.

Molecular detection using an optical waveguide fixed to a cantilever

An optical shuttle system for routing signals in a communications system that includes a terminal connected to a power source, a shuttle that includes waveguides used for routing the signals, and a beam connected to the terminal and the shuttle so that the beam suspends the shuttle. When power from the power source is applied to the terminal, the beam drives a movement of the shuttle. Furthermore, a method of using an optical shuttle system for routing signals in a communications system, the method includes connecting a terminal to a power source, connecting a shuttle to a beam to suspend the shuttle, and applying power from the power source to the terminal so that the beam drives a movement of the shuttle in a direction substantially perpendicular to a direction of the beam.

Optical shuttle system and method used in an optical switch

A tunable microelectromechanical (MEMS) spectrophotometer with a rotating cylindrical reflective diffraction grating is integrated with a photodetector and an optical fiber light source on a Rowland circle on a monolithic silicon substrate.

Structure and method for a microelectromechanic cylindrical reflective diffraction grating spectrophotometer

A mirror for an optical MEMS device has a plurality of segments supported on a substrate layer. Each segment includes a support post, a support layer, and a reflective layer formed over the support layer. The reflective layers of the plurality of segments form the reflective surface of the mirror. Due to the relatively small lateral dimensions of the segments, the mirror has a smaller thermal bow than prior art mirrors. The bow can be controlled, e.g., by appropriately choosing the number of segments and the layer thicknesses.

Mirror for an integrated device

An integrated piezo-resistive sensor for determining mirror position in an optical switch. One or more piezo-resistive layers may be formed in silicon springs supporting a movable mirror in the switch. Change in resistivity of those layers due to spring deformation during mirror motion is measured and related to the mirror deflection angle. Information about the angle may be used to provide feedback to the motion actuator, which then may be operated to orient the mirror more accurately. A sensor's sensitivity may be increased by appropriately orienting the springs with respect to the crystallographic axes of the silicon.

Piezo-resistive sensing of mirror position in an optical switch

A multilayer micromirror structure that exhibits substantially no form change as a result of a given change in temperature is disclosed. A reflective layer is disposed on a substrate layer, and a counterbalancing structure is disposed on the structure in a way such that a neutral plane is located at a predetermined position relative to the substrate layer and the reflective layer. When forces are exerted at the neutral plane of such a structure, the structure attains a predetermined geometric form. A method of manufacture is disclosed wherein a substrate is etched to define a desired structure and a conformal layer of a masking material is deposited onto the etched substrate. Further etching exposes portions of the substrate and silicon is deposited to achieve another desired structure. Excess material is etched away to free the finished structure and a reflective layer is deposited onto the surface of the structure.

Micromirror having counterbalancing structures and method for manufacturing same

The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

Micromechanical and microoptomechanical structures with single crystal silicon exposure step

A III-V compound light emitter is integrated with Si-based actuators. The proposed devices take advantage of the superior optical properties of III-V compounds and the superior mechanical properties of Si, as well as mature fabrication technologies of Si-Micro-Electro-Mechanical Systems (MEMS). The emitter can be a light emitting diode (LED), a vertical cavity surface emitting laser (VCSEL) or an edge emitting laser. Electro or magnetic based actuation from Si-based actuators provides

Scanning III-V compound light emitters integrated with Si-based actuators

A micro-optoelectromechanical system based device with aligned structures comprises at least one optical structure formed in a silicon layer of the device and at least one optical fiber connection structure that is self-aligned with the at least one optical structure. In embodiments, the at least one optical fiber connection structure is formed in a substrate of the device and may comprise a V-groove. In other embodiments, the at least one optical structure may comprise a waveguide. A nitride layer may be formed on at least a portion of the waveguide. In various embodiments, the silicon layer may be a single-crystal-silicon layer of a silicon-on-insulator wafer. A method for fabricating a micro-optoelectromechanical system based device with aligned structures is provided in which the at least one optical structure and the at least one optical fiber connection structure are defined using the same masking layer.

Micro-optoelectromechanical system based device with aligned structures and method for fabricating same

The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.

Process for manufacturing micromechanical and microoptomechanical structures with backside metalization

The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a pattern on a single crystal silicon layer separated by an insulator layer from a substrate layer; defining a structure in the single-crystal silicon layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; and releasing the formed structure.

Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning

The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilicon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step

A semiconductor structure includes a substrate, a sacrificial layer formed on or over the substrate, and a structural layer formed on or over the sacrificial layer. At least one opening is formed in the structural layer. At least one opening is formed in the sacrificial layer below the at least one opening in the structural layer. The at least one opening in the structural layer and the at least one opening in the sacrificial layer are at least partially filled with a filler material. At least one portion of the structural layer is removed to define at least one microstructure. The sacrificial layer is removed such that the at least one microstructure is released from the substrate and the filler material forms one or more protrusions on the at least one microstructure, and/or one or more anchors anchoring the at least one microstructure to the substrate.

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Madison, NJ, United States of America

Alex T Tran