Osram Opto Semiconductors Gmbh

Alex Kheng Hooi Lim

Tomin Liu

Wing Yew Wong

Hui Ying Pee

Asliza Alias

Hui Chiang Teoh

Mei See Boon

Yuan Liang

Lay Teng Tan

In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

Growing community of inventors

Penang, Malaysia

Alex Kheng Hooi Lim