Vishay Sprague, Inc.

Vishay Israel Ltd.

Alex Eidelman

Pavel Vaisman

Yuri Stangrit

Stephen Breithaupt

Yongjian Qiu

Matthew Lang

Andrey Mitiagin

Timothy Bishop

Ilia Skatkov

Haim Goldberger

Natali Ostrovsky

Hila Eshel

Leonid Vasserman

Evgeny Petukhov

Anatoly Agulyansky

Gabi Shilo

Sarah Lastella

John Evans

Edward Fairfield

Rita Eisenberg

Vicki Segel

Reuven Katraro

Nissim Cohen

Steve Breithaupt

John E Van Voorhis

Ilia Statkov

A capacitor may include a stack assembly. The stack assembly may include a plurality of anode plate members, each having an embedded wire. The anode plate members may be separated by at least one cathode foil sandwiched between separator sheets. A conducting member may electrically connect the embedded wires and may have an externally accessible end portion that is hermetically sealed from the interior of the capacitor. A case covers the stack assembly and may be attached to a cover. The case and cover may enclose the stack assembly within an interior area of the capacitor. The at least one cathode foil may be connected to the case. An electrolyte fluid may be disposed within the interior area of the capacitor. A passage may be provided through a central portion of the stack assembly. A tube, surrounded by insulation, may pass through the passage and may be connected to the cover and the case.

Low profile wet electrolytic tantalum capacitor

A hermetically sealed polymer capacitor and a method of forming the same are disclosed. The method preferably includes dispensing an amount of conductive paste inside a case and inserting one or more capacitor elements into the conductive paste. The conductive paste may surround sides of the one or more capacitor elements. Optionally, a bushing may be placed on the one or more capacitor elements. The bushing may have one or more holes that allow one or more positive leads coupled to the one or more capacitor elements to pass through. A cover is preferably welded to the opening of the case. The capacitor assembly is preferably dried to evacuate moisture from inside the case. The one or more positive leads are preferably welded to one or more metal tubes of a glass to metal seal (GTMS) in the cover to seal the capacitor assembly.

Hermetically sealed surface mount polymer capacitor

Disclosed are tantalum capacitors having enhanced volumetric efficiency, effective series resistance, effective series inductance, and high frequency performance when compared to existing tantalum capacitors. Also disclosed is a screening process for tantalum capacitors to enhance reliability.

High performance and reliability solid electrolytic tantalum capacitors and screening method

A low profile wet electrolytic capacitor is disclosed. The low profile wet electrolytic capacitor includes an outer case assembly. The outer case assembly is formed by an outer case and outer case cover that is hermetically sealed to the outer case. The outer case assembly includes an interior area. A capacitive element is positioned in the interior area. The capacitive element is isolated from the outer case assembly by a plurality of insulative elements. A connecting tube is positioned perpendicular to and attached to the outer case and the outer case cover and passes through an opening in the capacitive element. An isolated positive lead is positioned on the outer case assembly and is in electrical communication with the capacitive element. A fluid electrolyte is contained in the interior area of the outer case assembly. A method of forming the capacitor and stacked capacitor assemblies is also provided.

Low profile flat wet electrolytic tantalum capacitor

A wet electrolytic surface mount capacitor has a body defining an interior area and having a fill port formed through a wall of the body. A capacitive element is positioned in an interior of the body and is isolated from the body. A surface mount anode termination is in electrical communication with the capacitive element and isolated from the body. A surface mount cathode termination is in electrical communication with the body. An electrolyte is contained in the interior area of the body, and is introduced into the interior area of the body through the fill port. A fill port plug is positioned adjacent the fill port. A fill port cover compresses the fill port plug against the fill port to seal the fill port, and may be welded in place. A method of forming the capacitor is also provided.

Volumetric efficiency wet electrolyte capacitor having a fill port and terminations for surface mounting

Methods of manufacturing a hermetically sealed wet electrolytic capacitor and a hermetically sealed wet electrolytic capacitor are described. A method of manufacturing a wet electrolytic capacitor includes forming a cathode of the capacitor by forming a case comprising a metal substrate, the metal substrate having an alloyed surface, depositing a smooth film comprising palladium and copper as a tacking layer on the alloyed surface of the metal substrate, and depositing a rough, high surface area layer on the tacking layer to achieve a high capacitance cathode. A first terminal is electrically connected to the cathode. An anode is formed. A second terminal is electrically connected to the anode. An electrolytic solution is disposed within the case, and the case is hermetically sealed.

Methods of manufacturing a hermetically sealed wet electrolytic capacitor and a hermetically sealed wet electrolytic capacitor

A hermetically sealed capacitor and method of manufacturing are provided. The hermetically sealed capacitor includes an anode element having an anode wire and a feed through barrel, a cathode element, a first case portion having a first opening portion and a second case portion having a second opening portion. The first and second opening portions form an opening configured to mate with the feed through barrel. The first opening portion may include a slot portion configured to receive the feed through barrel. The hermetically sealed capacitor may also include electrolytic solution disposed between the first and second case portions.

Hermetically sealed electrolytic capacitor

An electrolytic capacitor includes a metal case, a porous pellet anode disposed within the metal case, an electrolyte disposed within the metal case, and a cathode element formed of an electrophoretically deposited metal or metal oxide powder of a uniform thickness disposed within the metal case and surrounding the anode. A method of manufacturing an electrolytic capacitor includes providing a metal case, electrophoretically depositing on the metal can a refractory metal oxide to form a cathode element, and placing a porous pellet anode and an electrolyte within the can such that the cathode element and the anode element being separated by the electrolyte.

Electrophoretically deposited cathode capacitor

A surface mount capacitor () and method for making the same. A solid slug or pellet anode body () is encapsulated in a case () of insulating material. An anode and cathode termination pair () are formed with surface mount mounting portions on one side of the case (). An electrical connection () is made from the cathode termination () to a cathode on pellet () through the case (). An electrical connection () is made between an anode associated with the pellet () and the anode termination () externally of the case (). The external connection () allows improved volumetric efficiency by freeing up space in the case () for a bigger pellet (). The method includes mass producing these capacitors () by mounting a plurality of pellets () on a lead frame () with pre-formed anode/cathode termination pairs (), at least substantially encapsulating the plurality of mounted pellets () and each pellet's associated anode and cathode, singulating the encapsulated pellets () to expose a portion of the pellet anode, and applying the electrical external conductive path () between pellet anode and anode termination ().

Method of manufacturing surface mount capacitor

The surface mount chip capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount chip capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount chip capacitor of the present invention is created by methods which include the steps of forming a wire and placing conductive powder upon the wire. An embodiment of the present invention, presses the wire from a foil sheet and electrophoretically depositing the conductive powder element upon the wire.

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Beer-Sheva, Israel

Alex Eidelman