International Business Machines Corporation

Alex A Behfar

Charles Hampton Perry

Kris V Srikrishnan

Dale Curtis McHerron

Muhammed I Hussain

Richard L Ehrlickman

A method for increasing the rate of transfer of web page data files having embedded data files between users of an Internet service and an Internet server. The method is implemented from a set of instructions read by a computer from a diskette. The executed method assigns a first communication channel of the computer to transfer a first data file between the server and the user. The data file is checked for the identity of embedded files, and the identity and address of the embedded files are stored in a table. The embedded files are thereafter transferred through the first communication channel and a second communication channel following transfer of the first data file. In the event that a data transfer of a file becomes stalled, an additional channel is assigned to simultaneously transfer the stalled file with the channel carrying the stalled file.

Method for transferring data files between a user and an internet server

A method of forming multiple SOI wafers from a plurality of individual wafers each having a first side and a second side. The method includes forming an oxide surface on the first side on each of the plurality of individual wafers and forming a hydrogen rich region at a preselected depth on the second side on each of the plurality of individual wafers. The wafers are then bonded into a stacked configuration and heat treated to fracture the wafers at the hydrogen rich regions. This fracture forms at least two SOI wafers.

Simultaneous multiple silicon on insulator (SOI) wafer production

An electrical connector or interposer for making connection in a high density device electronic environment. The connector is made of a high density array of nickel columns held in a layer of polyimide with each column extending beyond the opposing surfaces of said layer of polyimide. The connector may be used to make temporary or permanent connection to electrical contacts without alignment. Connection may be accomplished by loading forces sufficient to form either an indentation or a penetration of solder ball contacts. Contact to a single chip or a full wafer of chips is facilitated for testing.

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Poughquag, NY, United States of America

Alex A Behfar