Stmicroelectronics S.r.l.

Alessandro Morcelli

Marco Veneri

Lorenzo Baldo

Roberto Carminati

Sebastiano Conti

Matteo Perletti

Marco Angelici

Alberto Danioni

Andrea Mario Onetti

Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.

Micro-electro-mechanical acoustic transducer device with improved detection features and corresponding electronic apparatus

In at least one embodiment, an interface electronic circuit for a capacitive acoustic transducer having a sensing capacitor is provided. The interface electronic circuit includes an amplifier, a voltage regulator, a common-mode control circuit, and a reference generator. The amplifier has an input coupled to an electrode of the sensing capacitor. The voltage regulator is configured to receive a regulator reference voltage, generate a regulated voltage based on the regulator reference voltage, and supply the regulated voltage to a supply input of the amplifier. The common-mode control circuit controls a common-mode voltage present on the input of the amplifier based on a common-mode reference voltage. The reference generator receives a supply voltage and generates the regulator reference voltage and the common-mode reference voltage with respective values that are variable as a function of the supply voltage.

Interface electronic circuit for a microelectromechanical acoustic transducer and corresponding method

Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.

The present disclosure relates to an image display system, including a television having a screen, a sound projector, a control unit in signal communication with said screen and said sound projector, said control unit being configured for said sound projector to project one or more audible beams in a room towards one or more target paths. The system includes an optical instrument having a frame and a pair of lenses, detection means and transmission means, said detection means being designed to receive at their input an audio signal having a frequency falling in a 20-20 kHz frequency band and to output a processed signal, said transmission means being designed to receive at their input said processed signal, and to output a calibration signal. The control unit calibrates said sound projector according to said calibration signal generated by said optical instrument.

Image display system for calibrating a sound projector

An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.

Wafer level assembly of a MEMS sensor device and related MEMS sensor device

An interface for expanding a signal starting from a first sensing signal and a second sensing signal, wherein a receiving intensity measuring element generates an intensity signal; and a selector is controlled to select each time the first sensing signal, the second sensing signal, or a combined signal deriving from a weighted combination of these signals. The selector uses a plurality of thresholds variable as a function of the intensity signal.

Interface for expanding the dynamic interval of an input signal of an acoustic transducer

A method for simultaneous playback of audio tracks from digital transceiver devices, which are adapted to define a communication network. The digital devices store audio tracks to be played. One of the digital devices is actuated as a Master device (M) and the remaining N digital devices as Slave devices. The master device generates a pilot signal by selecting a pilot audio track to be played from among stored audio tracks and by adding a synchronization frequency (f) to the pilot audio track, having an assigned value that falls out of the sound wave frequency range. The Slave devices receive a pilot portion of the pilot signal and extract the synchronization frequency and the received part of the pilot audio track. The slave devices use the pilot to identify a stored track to be played using the synchronization frequency as a sampling frequency.

Method and system for simultaneous playback of audio tracks from a plurality of digital devices

Embodiments described in the present disclosure relate to an array microphone apparatus for generating a beam forming signal. The apparatus includes first, second, and third omni-directional microphones, each converting an audible signal into a corresponding electrical signal. The three microphones are arranged in a horizontal coplanar alignment, and the second microphone is disposed between the other two microphones. The apparatus includes a first directional microphone forming device to jointly output a first directional microphone signal with a first bi-directional pattern, and a magnitude and phase response handler device to output a second directional microphone signal with an omni-directional pattern shifted by a prefixed value with respect to first directional microphone signal. The apparatus further includes a combining device receiving the first and second directional microphone signals and outputting a combined directional microphone signal with a combined beam pattern correlated to the first bi-directional and second omni-directional patterns, the combined directional microphone signal being perpendicular to the horizontal coplanar alignment of the first, second, and third omn-directional microphones.

Growing community of inventors

Montello, Italy

Alessandro Morcelli