Solaria Corporation

Xilinx, Inc.

Alelie Funcell

Kevin R Gibson

Suvi Sharma

Rick Briere

Soon-Shin Chee

Douglas R Battaglia, Jr

Abhay Maheshwari

Ramon R Regos

A method for manufacturing solar strips. The method includes providing a photovoltaic material including a back side region, a front side surface, and a plurality of photovoltaic strip regions separated by a plurality of scribe regions. A first portion of the photovoltaic material is supported while a second portion of the photovoltaic material including at least one of the photovoltaic strips is left unsupported. The method includes applying a predetermined force along a portion of the photovoltaic strip that remains unsupported to cause the photovoltaic strip to be separated from the supported photovoltaic material.

Method and system for separating photovoltaic strips

A solar cell concentrator structure includes a first concentrator element having a first aperture region and a first exit region including a first back surface region and a first corner region. The structure also includes a second concentrator element integrally formed with the first concentrator element. The second concentrator element includes a second aperture region and a second exit region-including a second back surface region and a second corner region. Additionally, the structure includes a first radius of curvature of 0.10 mm and less characterizing the first corner structure and the second corner structure, a first coupling region between the first exit region and a first surface region of a first photovoltaic device. The structure further includes a second radius of curvature of 0.10 mm and less characterizing a region between the first concentrator element and the second concentrator element.

Solar cell structure including a plurality of concentrator elements with a notch design and predetermined radii and method

A solar cell device. The device has a first lead frame member including a first end and a second end and a second lead frame member coupled to the first lead frame member. In a specific embodiment, the second lead frame member includes a third end and a fourth end. The device also has a plurality of first bonding sites numbered fromthrough N between the first end and the second end of the first lead frame member, where N is an integer greater than 2. The device has a plurality of second bonding sites numbered fromthrough N between the third end and the fourth end, where N is an integer greater than 2. Depending upon the specific embodiment, the device has a plurality of photovoltaic regions numbered fromthrough N respectively bonded onto the plurality of first bonding sites numbered fromthrough N and second bonding sites numbered fromthrough N.

Method and resulting structure for assembling photovoltaic regions onto lead frame members for integration on concentrating elements for solar cells

A solar cell concentrator structure includes a first concentrator element having a first aperture region and a first exit region including a first back surface region and a first corner region. The structure also includes a second concentrator element integrally formed with the first concentrator element. The second concentrator element includes a second aperture region and a second exit region-including a second back surface region and a second corner region. Additionally, the structure includes a first radius of curvature of 0.25 mm and less characterizing the first corner structure and the second corner structure, a first coupling region between the first exit region and a first surface region of a first photovoltaic device. The structure further includes a second radius of curvature of 0.15 mm and less characterizing a region between the first concentrator element and the second concentrator element.

Solar cell structure including a plurality of concentrator elements with a notch design and predetermined RADII and method

A photovoltaic strip is physically separated from a semiconductor wafer utilizing physical sawing or other techniques. In accordance with one embodiment, a type of semiconductor wafer is first determined by interrogating the wafer to identify one or more of its optical, thermal, or electrical characteristics. This information regarding substrate type is then communicated to a separation apparatus, which then accomplishes precise physical separation of the substrate into discrete strips. Electrical performance of the strips may be tested prior to their incorporation into an assembled solar cell, where they are coupled to a concentrating element utilizing an elastomer encapsulant.

Fabrication process for photovoltaic cell

Shaped solar cell package

An electrical coupling device for solar cells includes a conductive member characterized by a single shaped thickness of material. The member includes a first portion extending a first length from a first end region and a second portion extending a second length from a second end region. The member also includes a U-like-shaped portion including a first branch, a second branch, and a joint region integrally connecting the first branch and the second branch. The first branch is integrally connected to the first portion at a first junction region and the second branch is integrally connected to the second portion at a second junction region. The first end region connects a first electrical lead of a first solar cell and the second end region connects a second electrical lead of a second solar cell which is disposed at flexible distance allowed by deforming the U-like-shaped portion elastically.

Electrical coupling device and method for solar cells

Rectangular solar cell package design

Shaped solar cell package design

Triangular solar cell design

Circular solar cell package design

Solar cell package design

A method of producing a carrier wafer for an integrated circuit is disclosed. The method comprises the steps of providing a carrier wafer having a plurality of bump pads and a plurality of wire bond pads; providing a passivation layer on the carrier wafer; etching a passivation layer over at least a portion of the plurality of bump pads; applying solder bumps on the plurality of bump pads; and separately etching the passivation layer over at least a portion of the plurality of wire bond pads. An integrated circuit employing a flip chip is also disclosed.

Growing community of inventors

Fremont, CA, United States of America

Alelie Funcell