3M Innovative Properties Company

Alejandro Aldrin Il Agcaoili Narag

Ravi Palaniswamy

Justine A Mooney

Arokiaraj Jesudoss

Andrew John Ouderkirk

Fong Liang Tan

Siang Sin Foo

Jian Gao

Nathan P Kreutter

Qihong Nie

James R White

Hiromitsu Kosugi

Wei Meng Pee

Flexible LED assemblies () are described. More particularly, flexible LED () assemblies having flexible substrates () with conductive features () positioned on or in the substrate, and layers of ceramic () positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Flexible LED assembly with UV protection

A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one via extending from the second major surface to the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semi-conductor device to the conductive layer.

Flexible light emitting semiconductor device

Provided is a flexible light emitting semiconductor device, such as an LED device, that includes a flexible dielectric layer having first and second major surfaces with a conductive layer on the first major surface and at least one cavity in the first major surface with a conductive layer in the cavity that supports a light emitting semiconductor device. The conductive layer in the cavity is electrically isolated from the second major surface of the dielectric layer.

Flexible LED device and method of making

Provided is a flexible light emitting semiconductor device (), such as an LED device, that includes a flexible dielectric layer () having first and second major surfaces and at least one via () extending through the dielectric layer from the first to the second major surface, with a conductive layer () on each of the first and second major surfaces and in the via. The conductive layer () in the via supports a light emitting semiconductor device () and is electrically isolated from the conductive layer () on the first major surface of the dielectric layer.

Flexible LED device for thermal management

Provided is an article comprising a flexible circuit comprising a polymeric dielectric layer having first and second major surfaces, one or both of the first and second major surfaces having a conductive layer thereon, wherein at least one conductive layer comprises an electrical circuit configured to power one or more light emitting semi-conductor devices located on the flexible circuit, wherein the flexible circuit is shaped to form a three dimensional structure.

Flexible light emitting semiconductor device having a three dimensional structure

Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.

Two part flexible light emitting semiconductor device

An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

Growing community of inventors

Singapore, Singapore

Alejandro Aldrin Il Agcaoili Narag