3m Innovative Properties Company

Alejandro Aldrin Ii Agcaoili Narag

Ravi Palaniswamy

Justine A Mooney

Siang Sin Foo

Andrew John Ouderkirk

Arokiaraj Jesudoss

Jian Gao

Fong Liang Tan

Hiromitsu Kosugi

Antonny Enojo Flor

Bee Leng Tan

Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Flexible LED assembly with UV protection

Provided is a light emitting semiconductor device comprising a flexible dielectric layer, a conductive layer on at least one side of the dielectric layer, at least one cavity or via in the dielectric substrate, and a light emitting semiconductor supported by the cavity or via. Also provided is a support article comprising a flexible dielectric layer, a conductive layer on at least one side and at least one cavity or via in the dielectric substrate. Further provided is a flexible light emitting semiconductor device system comprising the above-described light emitting semiconductor device attached to the above-described support article.

Two part flexible light emitting semiconductor device

Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.

Light emitting semiconductor device and substrate therefore

An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

Flexible LED device with wire bond free die

Growing community of inventors

Singapore, Singapore

Alejandro Aldrin Ii Agcaoili Narag