Koninklijke Philips Corporation N.v.

Minim, Inc.

Alec Rooney

Wojtek Sudol

Brevard S Garrison

Rodney J Solomon

Benjamin M Herrick

Francis E Gurrie

Walter Patrick Kelly, Jr

Jeremy Hitchcock

Matthew A Keary

Denis Bakin

Marienne Moro Sanders

Zachary Mattor

Jonathan T Rajewski

Peter Fry

A system includes local area network (LAN) devices in communication with network devices external to the LAN. An agent in the LAN examines traffic between LAN devices and external devices. The agent executes scans of the LAN devices, generates fingerprint and telemetry data for the LAN devices, and sends the telemetry data and the fingerprint data to a cloud server external to the LAN. The cloud server receives telemetry data and fingerprint data and updates a device attribute database with fingerprints and/or device profiles for the LAN devices to identify anomalous behavior of the LAN devices.

System and method for device context and device security

A network device is onboarded to a Wi-Fi local area network (WLAN) including a WLAN router and a mobile device. An optical symbol displayed on the network device is scanned by the mobile device and used to obtain an onboarding network credential mapped to data encoded in the optical symbol. The onboarding network credential is provided to the WLAN router, which creates an onboarding Wi-Fi network based upon the onboarding network credential. A provisioning parameter is wirelessly conveyed to the network device via the onboarding Wi-Fi network, where the network device was pre-configured to communicate via the onboarding Wi-Fi network.

System and method for onboarding in a Wi-Fi mesh network

An acoustic backing element includes a glass fiber epoxy composite planar substrate to the outer major surfaces of which are applied electrically conductive material. The electrically conductive material may be a conductive layer that is etched to expose electrical contact material in the form of conductive traces. Each conductive trace provides electrical connection between a transducer element and electrical control circuitry typically located on an electrical circuit board. The acoustic backing element provides precisely located electrical contacts for connecting the transducer elements to their control circuitry, while simultaneously providing superior acoustic attenuation. In addition, the thermal coefficient of expansion (TCE) of the glass fiber epoxy composite material comprising the planar substrate can be closely matched to the TCE of the electrical contact material. In this manner, fatigue and failure caused by mechanical stresses between the planar substrate and the electrical contact material due to temperature extremes and temperature cycling are significantly reduced.

Ultrasonic transducer backing assembly and methods for making same

A biopsy needle guide in accordance with the invention is configured for attachment to an ultrasound transducer. The biopsy needle guide is arranged in two sections, an inner attachment block and an outer attachment block. The inner attachment block includes (i) a coupler which attaches the inner attachment block to the ultrasound transducer and (ii) a first engagement structure which extends from a surface thereof. The outer attachment block includes a biopsy needle guide through hole and a second engagement structure. The second engagement structure releasably mates with the first engagement structure even when the inner attachment block is covered by a sterile film sheath.

Biopsy needle guide for attachment to an ultrasound transducer

Growing community of inventors

Eliot, ME, United States of America

Alec Rooney