Nordson Corporation

Asymptotic Technologies, Inc.

Duong T. La

Carlos E. Bouras

Mark S. Meier

Alan R. Lewis

Andre S. Gamelin

Alec J. Babiarz

Alec J Babiarz

Alan Ray Lewis

Robert L Ciardella

Horatio Quinones

Carlos E Bouras

Duong T La

Erik A Fiske

Thomas L Ratledge

Mark S Meier

Floriana Suriawidjaja

Philip P Maiorca

Christopher L Giusti

Kenneth S Espenschied

Todd S Weston

Stephane Etienne

Ron Abernathy

Nicholas Anthony Barendt

James Everett Cooper, Jr

Patrick R Jenkins

Raymond Andrew Merritt

Naoya Ian Nagano

Joe Sherman

Owen Yikon Sit

James C Smith

Stanley Cruz Aguilar

Ronald N Abernathy

John Newbold

Phillip P Maiorca

John L Christofferson

Eric L Austin

Andre S Gamelin

Jason Thomas Vint

Drusilla Bertone Cursi

Michael A Reighard

John P Byers

Jiangang Zhao

Rick Zakrajsek

Phil Maiorca

Alan R Lewis

Erik Fiske

Thomas Ratledge

Robert Ciardella

Systems and methods for automated inspection of fillet formation along on or more peripheral edges (a) of a packaged microelectronic device () that is attached to a supporting substrate (), such system () including a feedback loop for controlling fillet formation. More specifically, the system () includes a dispensing system () configured for dispensing underfill material () onto the supporting substrate (). The system () further includes an automated optical inspection (AOI) system () configured for determining a value of a measurable attribute of the fillet (), such as whether the fillet () is properly dimensioned, i.e., sized and shaped. A feedback loop () is included between the dispensing system () and automated optical inspection system (). The feedback loop () is configured to communicate information from the AOI system () to the dispensing system () to permit adjustment of one or more operating parameters thereof, thereby maintaining proper dimensions of the fillet ().

Automated fillet inspection system with closed loop feedback and methods of use

A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.

Viscous material noncontact jetting system

Systems and methods for automated inspection of fillet formation along on or more peripheral edges () of a packaged microelectronic device () that is attached to a supporting substrate (), such system () including a feedback loop for controlling fillet formation. More specifically, the system () includes a dispensing system () configured for dispensing underfill material () onto the supporting substrate (). The system () further includes an automated optical inspection (AOI) system () configured for determining a value of a measurable attribute of the fillet (), such as whether the fillet () is properly dimensioned, i.e., sized and shaped. A feedback loop () is included between the dispensing system () and automated optical inspection system (). The feedback loop () is configured to communicate information from the AOI system () to the dispensing system () to permit adjustment of one or more operating parameters thereof, thereby maintaining proper dimensions of the fillet ().

Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.

Methods for vacuum assisted underfilling

Systems and methods for automated inspection of fillet formation along on or more peripheral edges () of a packaged microelectronic device () that is attached to a supporting substrate (), such system () including a feedback loop for controlling fillet formation More specifically, the system () includes a dispensing system () configured for dispensing underfill material () onto the supporting substrate () The system () further includes an automated optical inspection (AOI) system () configured for determining a value of a measurable attribute of the fillet (), such as whether the fillet () is properly dimensioned, i e, sized and shaped A feedback loop () is included between the dispensing system () and automated optical inspection system ().

Apparatus and methods for dispensing small amounts of a viscous material onto a workpiece. The narrow-profile dispensing apparatus includes a fluid chamber, a nozzle, and a valve seat disk representing individual components that are removable from a main body of the dispensing apparatus for cleaning and/or replacement. The nozzle is coupled with the fluid chamber by a heat transfer body that may be cooled by, for example, a cooling fluid routed through an air pathway defined in the heat transfer body. The main body of the dispensing apparatus may be cooled by air exhausted from an air cavity of a pneumatic actuator regulating the movement of a needle to control the flow of viscous material in the dispensing apparatus.

Apparatus and method for dispensing discrete amounts of viscous material

A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate. Alternatively, the controller adjusts a rate of delivery of the metering device based on the calculated flow rate to cause the dispensing element to dispense the desired amount of material along the predetermined pattern. Closed loop temperature control may be provided for the dispensing element and/or the substrate to ensure a substantially constant viscosity and a substantially constant flow rate. A prime and purge station may be provided adjacent the substrate for sucking air bubbles from the dispensing element and metering device.

Flip chip underfill system and method

Method of dispensing a viscous material

A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.

Apparatus for underfilling semiconductor devices

Growing community of inventors

Encinitas, CA, United States of America

Alec J Babiarz