International Rectifier Corporation

Aldo Torti

Mario Merlin

Jonas Aleksandravicius

Emilio Mattiuzzo

Massimo Grasso

Andrea Merello

Algirdas Kaskonas

Gene Pranauskiene

Sebastiaro Ferrero

Stefano Santi

Current through a wire is sensed with a shunt resistor and a sense resistor in a current divider circuit. The values of the shunt resistor and sense resistor are related to provide a specified gain ratio to increase a dynamic range of current measurement. The sense resistor is a trimmable resistor, the configuration of which can be discerned from a look-up table based on a level of precision needed for current measurement. The two resistors can also be related by thermal coefficients to improve linearity of current measurements.

Current sense shunt resistor circuit

A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. The annular flange preferably comprises a projection having a squared tab and circular distal end that is received by a receiving groove having a notch (to receive the squared tab) and a cavity (to receive the distal end).

Compression assembled electronic package having a plastic molded insulation ring

A process for joining a steel terminal to a copper electrode comprises applying a thin silver-copper flash to the surface of a copper electrode and bringing a steel surface into contact with the flash during high frequency welding. The weldment is improved compared to conventional welds that do not incorporate the flash layer. For example, a silver&mdash;18 wt % copper alloy having a thickness of about 180 microns produced uniform, high quality welds between nickel steel terminals and 99.999% pure copper electrodes.

Process to weld steel to copper

A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ring disposed around the power semiconductor die. The pole pieces are secured to respective ends of the plastic molded insulation ring. One of the pole pieces may include an annular flange that penetrates the plastic molded insulation ring from an interior wall thereof and is embedded in its body. An annular flange may also be embedded in the plastic molded insulation ring and connected to an annular rib of a pole piece by a circular connector.

A force-fit diode for high circuit application has a cylindrical constant diameter conductive body which has a tapered top and bottom peripheral edge. An axial conductor extends from one end of the housing. The tapered top and bottom peripheral edges allow the housing to be forced into an opening in the bus, with either the housing bottom or the axial lead being the first to enter the openings.

Press-fit diode for universal mounting

A low resistance high current sense resistor is formed on a semiconductor die using conventional semiconductor processing techniques. The resistor die has one or two resistive layers which are photolithographically divided into a plurality of series and parallel resistor sections connected to first and second main terminals. First and second sense terminals are connected across one or a pattern of plural ones of the resistors to produce an output related to the current between the main terminals. Fusible links permit the trimming of the final resistance value.

High current sense resistor and process for its manufacture

A semiconductor device module is formed of four identical frame sections which each have a flat base and perpendicularly extending strap terminal. Semiconductor chips are soldered to the center of the top surfaces of each base, and the devices are interconnected by flat brass strips having one end soldered to the top of one chip and the other end soldered to the base of an adjacent section. The base sections lie in a common plane at the bottom of an insulative filled insulation cup. The terminals extend parallel and out of the top of the cup.

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San Carlo Canavese, Italy

Aldo Torti