Robert Boschgmbh

Ant Nachrichtentechnik Gmbh

Tesat Spacecom Gmbh Kg

Albrecht Kuke

Heiner Hauer

Eberhard Moess

Bernhard Schwaderer

Roland Mueller-Fiedler

Werner Scholz

Klaus-Michael Mayer

Wolf-Henning Rech

Thomas Schwander

Lars Bartelt-Berger

Ulrich Kohn

Dieter Maurer

Martin Warth

Helmut Reppe

Matthias Mauritz

Raimund Fritscher

Ralpf Sommerfeldt

Klaus Hirche

Mounting method for a miser laser having a miser crystal on the base surface of a housing, which has a side wall with a housing window for the miser exit beam, is provided. A reference beam is directed through the housing window on to the crystal end face of the miser crystal with an inverted light beam direction which the miser beam to be generated is later to have. An adjusting device which permits mutually independent movements, on the one hand in a direction parallel to the reference beam, and on the other hand perpendicular thereto and parallel to the housing base, and also permits rotations about an axis of rotation perpendicular to the housing base, is used to preadjust the premounted miser stack such that the angle between the surface normal of the crystal end face and the reference beam is approximately 45&deg;, and the reference beam strikes the crystal end face approximately at its center. In the as yet not optimally adjusted case, all the reflections are united on a display screen by displacing the miser transverse to the direction of the reference beam and by rotation.

Method for assembling a miser laser with fibre coupling

The arrangement focuses a combined laser beam ( ) composed of individual laser beams produced by laser diodes ( ) on a common spot. Prismatic reflecting bodies ( ) are arranged in depressions ( ) provided in a common substrate ( ) between parallel rows (R ,R ; R ,R ) of the laser diodes ( ). Each reflecting body ( ) has oppositely inclined reflecting surfaces arranged on opposite sides thereof for deflection of the individual laser beams from the two adjacent rows of laser diodes. Two cylindrical lenses ( ) are arranged on opposite sides of each reflecting body ( ) between the laser diodes and the reflective surfaces to convert elliptical remote fields of the laser beams into circularly symmetric remote fields. Laterally movable focusing lenses ( ) for each individual laser beam are arranged on the reflecting bodies ( ) between the common spot and the reflecting surfaces for individual adjustment of the laser beams, whereby the combined laser beam ( ) is focussed on the common spot.

Arrangement for aligning the light beam paths of a group of laser diodes on a common spot, especially for providing pumping light for a solid state laser

The invention is directed to a high-frequency semiconductor laser module with a silicon substrate, especially made of low-impedance silicon, a laser diode arranged thereon, and at least two lines for the H-F feed, one of which is insulated from the silicon substrate by a dielectric layer. According to the invention, the laser diode is arranged on the silicon substrate via a metallic mounting layer, and the H-F line is guided close to the laser diode on the dielectric layer.

High-frequency semiconductor laser module

The device for generating an electrical control according to a position of a light beam in relation to a separating line includes two photodetectors (,), one (,) of which is arranged for detecting light falling on one side of the separating line and another (,) of which is arranged for detecting light falling on another side of the separating line. The separating line is an edge (,) extending between two (1,1,1) crystallographic planes of a crystalline substrate and the (1,1,1) crystallographic planes reflect respective parts of the light beam to the respective photodetectors.

Device for generating an electrical control signal according to the position of a light beam

In the method of bonding two parts (,) together a positioning device (,) accurately positions the two parts (,) relative to each other and a comparatively slower hardening adhesive layer (,) is applied between the two parts (,) to bond the two parts (,) together. After the adhesive layer (,) is applied and the parts positioned, a faster hardening UV adhesive (,) is applied on adjacent edge regions of the two parts (,) over an edge of the slower hardening adhesive layer (,), so that the faster hardening UV adhesive (,) is accessible for UV irradiation. Subsequently the faster hardening UV adhesive (,) is hardened with the UV radiation and the positioning device (,) is removed from the parts (,) which are held fixed in a provisional manner. Then the slower hardening adhesive layer (,) is hardened preferably in an oven that can be used for a large number of similar pairs of parts.

Bonding method using fast hardening UV adhesive and slower hardening adhesive

The circuit board (1) has a component (101) mounted on it by means of a soldering process which causes an automatic, passive alignment of the component (101) due to the surface tension in a melted piece of solder which electrically connects two pads (2, 102), one (102) of which is on the component and the other (2) of which is on the circuit board. Stand-offs (20) are used to provide a suitable spacing or distance between the component (101) and the circuit board (1). The other pad (2) has a surface that is divided into a central part (3) and an edge part (4), both wettable by the solder. The second or edge part (4) is shaped like a ring and surrounds the central part and is composed so that it is more slowly wettable by the solder than the central part. The spacing established by the stand-offs is dimensioned so that a melted piece of the solder between the pads produces a force drawing the component (101) toward the circuit board (1) because of surface tension in the melted solder.

Circuit board arrangement with accurately positioned components mounted

An optical, beam-splitting component has a prism carrier plate which supports a prism member upon which a deflecting layer is applied. At the same time, the prism member juts into a groove between two optical waveguides carrying the light signals.

Optical, beam-splitting component and a method for producing a prism

In the case of the above devices, accurate adjustment is very important; the devices ought, however, to be very compact. It is not sufficient to utilize the silicon etching technique for accuracy. The optical transmitting element (LD) is located on a first holder (T1), and the optical receiving element (PD) and the transmission fiber (Fa) are located on a third holder. Provided there between is a second holder (T2) which is transparent to the wavelength of the light emitted by the transmitting element (LD). The holders are structured by means of anisotropic etching in order to render it possible to receive the individual components. Furthermore, the holders lie flat on one another and can be so adjusted. A monitor diode (MD) is provided.

Optical transmitting and receiving device having a surface-emitting laser

The arrangement for coupling optoelectronic components and optical waveguides to one another includes a carrier substrate (11); at least one optoelectronic component (9) or one optical waveguide (1) secured on the carrier substrate (11) and at least one lens (8) provided with an essentially planar surface and a spherical surface located opposite the essentially planar surface. The carrier substrate is provided with a depression (5) for a lens (8) having walls and the lens (8) is inserted into the depression (5) so that the lens (8) rests with its spherical surface contacting the walls of the depression (5) at at least 3 points and is rotatable about its spherical curvature center point. An adjustment device for rotatably positioning the lens (8) in the depression and a method of securing the lens in position after an adjustment are described.

Arrangement for coupling optoelectronic components and optical

The invention relates to an optical fiber amplifier having an amplification waveguide, having a pump source and having a wavelength-selective coupler. The pump light from the pump source is coupled into the amplification waveguide via the coupler. A carrier substrate (GS) is provided, on which passive (eg. couplers, dividers) and active components (eg. amplification waveguides) of the fiber amplifier are integrated. In addition, a silicon carrier (ST1) is provided, which is fitted to one end of the carrier substrate (GS). The silicon carrier (ST1) has anisotropically etched grooves with optical components. The pump source is fixed on the silicon carrier (ST1). The optical components on silicon carrier (ST1) and carrier substrate (GS) are adjusted in relation to one another.

Optical fiber amplifier

In the case of the above devices, exact adjustment is very important; however, the devices ought to be very compact. It is not sufficient to utilize the silicon etching technique for the precision. The optical transmitting element (LD) is situated on a first carrier (T1), the optical receiving element (PD) and the transmission fiber (Fa) are situated on a third carrier. Provided in between them is a second carrier (T2) which is transparent to the wavelength of the light emitted by the transmitting element (LD). The carriers are structured by means of anisotropic etching in order to make possible the accommodation of the individual components. In addition, the carriers lie flat on one another and can thus be adjusted. A monitor diode (MD) is provided. Application of the arrangement in all transmission systems having optical waveguides.

Optical fiber transmitting and receiving communications device

The laser module couples its semiconductor laser to an optical device, e.g. an optical fiber, particularly a monomode fiber. The laser module includes a micromechanically structured silicon substrate (31) provided with an elongated groove (30) having a longitudinal axis by an anisotropic etching technique; a semiconductor laser (110) mounted on the silicon substrate (31) to emit light parallel to the longitudinal axis of the elongated groove; an optical coupling device including an isolator (10) positioned on the silicon substrate (31) so that light from the semiconductor laser (110) passes therethrough and a sealed housing (50) inside of which the silicon subtrate (31), the semiconductor laser (110) and the isolator are contained. At least a portion of the optical components mounted in the elongated groove and not rotationally symmetrical with respect to forward light transmission properties are each provided with at least one flat edge surface (210,210') bearing on an anisotropically etched wall of the elongated groove (30).

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Auenwald, Germany

Albrecht Kuke