Cooledge Lighting, Inc.

Epistar Corporation

Alborz Amini

Michael Albert Tischler

Henry Ip

Thomas Pinnington

Gianmarco Spiga

In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

Light-emitting dies incorporating wavelength-conversion materials and related methods

In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or light-detecting element) suspended in the binder and within the aperture of the frame.

In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.

Systems for adhesive bonding of electronic devices

In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.

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Vancouver, Canada

Alborz Amini