Lam Research Corporation

Albina Zieliene

Eugenijus Norkus

Yezdi N Dordi

Aniruddha Joi

Aldona Jagminiene

Ina Stankeviciene

Algirdas Vaskelis

Loreta Tamasauskaite-Tamasiunaite

A method for providing an electroless plating of a platinum containing layer is provided. A Tistabilization solution is provided. A Ptstabilization solution is provided. A flow from the Tistabilization solution is combined with a flow from the Ptstabilization solution and water to provide a diluted mixture of the Tistabilization solution and the Ptstabilization solution. A substrate is exposed to the diluted mixture of the Tistabilization solution and the Ptstabilization solution.

Electroless deposition of continuous platinum layer

An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthenium plating solution is also provided.

Plating solutions for electroless deposition of ruthenium

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Vilnius, Lithuania

Albina Zieliene