USA As Represented by Secretary of the Navy

Photon Dynamics, Inc.

Alberto Pique

Douglas B Chrisey

R Andrew McGill

Bradley R Ringeisen

James S Horwitz

Heungsoo Kim

Lydia J Young

Raymond C Y Auyeung

Zakya H Kafafi

Raymond Auyeung

Gary P Kushto

Thomas H Bailey

Craig B Arnold

David B Krizman

Syed B Qadri

Earl F Skelton

Scott A Mathews

Bhanu Sood

Michael W Nurnberger

Joachim Eldring

Huey-Daw Wu

Steven Edward Birrell

Alan Cable

James M Fitz-Gerald

Henry Daniel Young

Joel Visser

Justin Kwak

Ray Auyeung

Rohit Modi

A laser decal transfer is used to generate thin film features by directing laser pulses of very low energy at the back of a target substrate illuminating an area of a thin layer of a high viscosity rheological fluid coating the front surface of the target. The illuminated area is shaped and defined by an aperture centered about the laser beam. The decal transfer process allows for the release and transfer from the target substrate to the receiving substrate a uniform and continuous layer identical in shape and size of the laser irradiated area. The released layer is transferred across the gap with almost no changes to its initial size and shape. The resulting patterns transferred onto the receiving substrate are highly uniform in thickness and morphology, have sharp edge features and exhibit high adhesion, independent of the surface energy, wetting or phobicity of the receiving substrate.

Laser decal transfer of electronic materials

A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to 'wire' the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

Laser-based technique for the transfer and embedding of electronic components and devices

An apparatus includes integrated review, material removal and material deposition functions. The apparatus performs the review, material removal and material deposition operations along the same optical axis. The apparatus includes, in part, a camera, a pair of lenses, and one or more lasers. A first lens is used to focus the camera along the optical axis on a structure formed on the target substrate undergoing review. The first lens is also used to focus the laser beam on the structure to remove a material present thereon if the reviewed structure is identified as requiring material removal. The second lens is used to focus the laser beam on a ribbon to transfer a rheological compound from a recessed well formed in the ribbon to the structure if the reviewed structure is identified as requiring material deposition.

Method of performing an operation with rheological compound

A method of preparing high capacity hydrous ruthenium oxide micro-ultracapacitors. A laser direct-write process deposits a film of hydrous ruthenium oxide in sulfuric acid under ambient temperature and atmospheric conditions. A dual laser process combining infrared and ultraviolet light is used for fabricating a complete wet electrochemical cell in a single processing step. Ultraviolet laser micromachining is used to tailor the shape and size of the deposited material into planar electrodes. The micro-ultracapacitors have improved size, weight, and cost efficiency and exhibit high specific power and high specific energy.

Self-filling wet electrochemical cells by laser processing

A method is provided for embedding electronic components including electrochemical cells within a circuit board substrate. The method includes micromachining the printed circuit board substrate to a selective depth to form a recess. A component is inserted into the recess and an electrical connection is established between the electrical component and a metallized pattern of the circuit board substrate using, e.g., laser direct-write.

Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials

A method for creating a microarray of biomaterial uses a source of laser energy, a receiving substrate, and a target substrate. The target substrate comprises a laser-transparent support having a laser-facing surface and a support surface. The target substrate also comprises a composite material having a back surface in contact with the support surface and a front surface. The composite material comprises a mixture of the biomaterial to be deposited and a matrix material. The matrix material is a material that has the property that, when it is exposed to laser energy, it desorbs from the laser-transparent support. The source of laser energy is positioned in relation to the target substrate so that laser energy is directed through the laser-facing surface of the target substrate and through the laser-transparent support to strike the composite material at a defined target location. The receiving substrate is positioned in a spaced relation to the target substrate. The source of laser energy has sufficient energy to desorb the composite material at the defined target location, causing the composite material to desorb from the defined target location and be lifted from the support surface of the laser-transparent support. The composite material is deposited at a defined receiving location on the receiving substrate. The steps are repeated at successive defined target locations and successive defined receiving locations such that the composite material is deposited in a microarray of deposited composite material. The method is useful for creating, for example, a gene recognition array,

Generation of biomaterial microarrays by laser transfer

A method for depositing a transfer material onto a receiving substrate uses a source of laser energy, a receiving substrate, and a target substrate. The target substrate comprises a laser-transparent support having a laser-facing surface and a support surface. The target substrate also comprises a composite material having a back surface in contact with the support surface and a front surface. The composite material comprises a mixture of the transfer material to be deposited and a matrix material. The matrix material is a material that has the property that, when it is exposed to laser energy, it desorbs from the laser-transparent support. The source of laser energy is positioned in relation to the target substrate so that laser energy is directed through the laser-facing surface of the target substrate and through the laser-transparent support to strike the composite material at a defined target location. The receiving substrate is positioned in a spaced relation to the target substrate. The source of laser energy has sufficient energy to desorb the composite material at the defined target location, causing the composite material to desorb from the defined target location and be lifted from the support surface of the laser-transparent support. The composite material is deposited at a defined receiving location on the receiving substrate. The method is useful for creating a pattern of biomaterial on the receiving substrate.

Generation of viable cell active biomaterial patterns by laser transfer

The invention relates to the deposition of transparent conducting thin films, such as transparent conducting oxides (TCO) such as tin doped indium oxide (ITO) and aluminum doped zinc oxide (AZO) on flexible substrates by pulsed laser deposition. The coated substrates are used to construct low cost, lightweight, flexible displays based on organic light emitting diodes (OLEDs).

Pulsed laser deposition of transparent conducting thin films on flexible substrates

A method for laser transfer and deposition of a rheological fluid wherein laser energy strikes a target substrate comprising a rheological fluid, causing a portion of the rheological fluid to evaporate and propel non-evaporated rheological fluid onto a receiving substrate.

Laser forward transfer of rheological systems

An device for depositing a transfer material onto a receiving substrate includes a source of pulsed laser energy, a receiving substrate, and a target substrate. The target substrate comprises a laser transparent support having a back surface and a front surface. The front surface has a coating that comprises a mixture of the transfer material to be deposited and a matrix material. The matrix material is a material that has the property that, when it is exposed to pulsed laser energy, it is more volatile than the transfer material. The source of pulsed laser energy is be positioned in relation to the target substrate so that pulsed laser energy is directed through the back surface of the target substrate and through the laser-transparent support to strike the coating at a defined location with sufficient energy to volatilize the matrix material at the location, causing the coating to desorb from the location and be lifted from the surface of the support. The receiving substrate is positioned in a spaced relation to the target substrate so that the transfer material in the desorbed coating can be deposited at a defined location on the receiving substrate.

Matrix assisted pulsed laser evaporation direct write

A composite layer of a sorbent, chemoselective, non-electrically-conducting polymer and nano-particles of an electrically conducting material dispersed throughout the polymer is formed on a substrate by pulsed laser deposition, matrix assisted pulsed laser evaporation or matrix assisted pulsed laser evaporation direct writing.

Fabrication of conductive/non-conductive nanocomposites by laser evaporation

This invention pertains to a device of a substrate and a ZrO,-based semiconductor disposed thereon and a method for depositing the semiconductor on the substrate. The semiconductor is typically in the form of a film of 1-20 weight % ZrO,and 99-80 weight % In,O,or SnO,. The semiconductor is tunable in terms of optical transmission and electrical conductivity. Its transmission is in excess of about 80% over the wavelength range of 400-900 nm and its resistivity is from about 1.3&times;10,&OHgr;-cm to about 6.5&times;10,&OHgr;-cm. The deposition method is characterized by depositing in a chamber the semiconductor on a substrate by means of a physical vapor deposition whole maintaining a small oxygen pressure in the chamber.

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Crofton, MD, United States of America

Alberto Pique