C.r.f. Societa Consortile Per Azioni

Societa Consortile Per Azioni

Alberto Pairetti

Piermario Repetto

Stefano Bernard

Davide Capello

Denis Bollea

Sabino Sinesi

Michele Antonipieri

Sara Padovani

Piero Perlo

A method of fabrication of transparent LED devices, of the type comprising the operations of: i) providing a series of conductive paths on a transparent underlayer; ii) connecting said conductive paths to electronic control means; iii) associating to said underlayer an array of LED sources addressable individually or in groups through said conductive paths, in which i) said LED sources are integrated in the form of chips, i.e., of elements obtained by dividing up a semiconductor wafer and without package, via technologies of the chip-on-board type; ii) said method envisages the use of the flip-chip technique for die bonding, i.e., the electrical connection of the chip to the underlayer.

Method for manufacture of transparent devices having light emitting diodes (LED)

Described herein is a transparent device for display of information superimposed on a background, said device comprising a plurality of LED sources, addressable individually or in groups through a series of conductive paths deposited on a transparent underlayer and connected to a control electronics, in which: i) said LED sources are integrated in the form of dice, i.e., of elements obtained by dividing up a semiconductor wafer and without package; and ii) at least one of said conductive paths is with interrupted stretches and replaced by stretches of metal wire, bonded to said paths through a wire-bonding operation.

Transparent LED display and method for manufacture thereof

Described herein is a transparent-display device for motor vehicles, to be used for presentation of information to the driver and/or to the passengers, said device comprising a plurality of LED sources, addressable individually or in groups through a series of conductive paths, deposited on a transparent underlayer and connected to a control electronics, in which: i) said LED sources are integrated in the form of dice, i.e., of elements obtained by dividing up a semiconductor wafer and without package; ii) said dice are integrated on, and electrically connected to, said underlayer via technologies of the chip-on-board type; and iii) said transparent underlayeris pre-arranged for being at least in part superimposed on the windscreen of the vehicle, in such a way that at least part of the information presented to the user is superimposed on the background, said background being visible to the user through said windscreen.

Transparent LED display

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Udine, Italy

Alberto Pairetti