Psiquantum Corp.

Apple Inc.

Linkedin Corporation

Albert Wang

Ramakanth Alapati

John Eugene Berg

Gabriel J Mendoza

Matteo Staffaroni

Paul Aurelio Martinez

Curtis C Mead

Brian Richards Land

Serhan O Isikman

Ueyn L Block

Chin San Han

Nevzat Akin Kestelli

Justin Shi

Brad W Simeral

Lin Chen

Yuta Kuboyama

Scott D Morrison

Ming Yuan Tsai

Caroline Gaffney

Elizabeth Ethel Burstein

Nipun Dave

Giancarlo F De La Cruz

Jeany Ngo

Daniel C Green

Tyler S Bushnell

Prashanth S Holenarsipur

Nicholas R Trincia

Wyeman Chen

Martin Schauer

Gang Ning

William K Smith

Vu Thanh Vo

Wegene H Tadele

Motohide Hatanaka

Won Seop Choi

Chirag V Shah

A system for generating clock signals for a photonic quantum computing system includes a first pump photon source, a first photon-pair source optically coupled to the first pump photon source, and a first photodetector optically coupled to the first photon-pair source. The system also includes a first clock generator electrically coupled to the first photodetector, a second pump photon source, a second photon-pair source optically coupled to the second pump photon source, and a second photodetector optically coupled to the second photon-pair source. The system further includes a second clock generator electrically coupled to the second photodetector and a clock mediator coupled to the first clock generator and the second clock generator.

Clock generation for a photonic quantum computer

A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. A coupler is bonded to a first surface of the first die, an optical fiber is coupled to the coupler for coupling light from the optical fiber to the quantum circuit.

Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die

A quantum computing system includes a photon processing system, a photon analyzer, and a photon source module coupled to the photon processing system and to the photon analyzer. The photon source module includes at least one photon source configured to discharge one or more photons per trigger signal and a photon multiplexer configured to direct the one or more photons to the photon processing system or to the photon analyzer.

Quantum tomography and photon source optimization

A photoplethysmographic (PPG) device is disclosed. The PPG device can include one or more light emitters and one or more light sensors to generate the multiple light paths for measuring a PPG signal and perfusion indices of a user. The multiple light paths between each pair of light emitters and light detectors can include different separation distances to generate both an accurate PPG signal and a perfusion index value to accommodate a variety of users and usage conditions. In some examples, the multiple light paths can include the same separation distances for noise cancellation due to artifacts resulting from, for example, tilt and/or pull of the device, a user's hair, a user's skin pigmentation, and/or motion. The PPG device can further include one or more lenses and/or reflectors to increase the signal strength and/or and to obscure the optical components and associated wiring from being visible to a user's eye.

Multiple light paths architecture and obscuration methods for signal and perfusion index optimization

A quantum device includes a cryogenic chamber and a quantum computing module positioned within the cryogenic chamber. The quantum computing module includes a silicon substrate and a quantum circuit (QC) die including a qubit integrated circuit. The QC die is attached to the silicon substrate. An electronic circuit (EC) die including an electronic integrated circuit is attached to the QC die such that the qubit integrated circuit and the electronic integrated circuit face each other. The QC die can be fusion bonded to the EC die. A circuit board (CB) includes a power converter configured to convert input power received from a cryogenic chamber feedthrough to output power that is coupled to the QC die and to the EC die.

Cryogenic power supply

A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. The device also includes a first interconnect between the quantum circuit and the electronic circuit and a second interconnect between the quantum circuit and the electronic circuit.

Photonic quantum computer assembly

A system for generating clock signals for a photonic quantum computing system includes a pump photon source configured to generate a plurality of pump photon pulses at a first repetition rate, a waveguide optically coupled to the pump photon source, and a photon-pair source optically coupled to the first waveguide. The system also includes a photodetector optically coupled to the photon-pair source and configured to generate a plurality of electrical pulses in response to detection of at least a portion of the plurality of pump photon pulses at the first repetition rate and a clock generator coupled to the photodetector and configured to convert the plurality of electrical pulses into a plurality of clock signals at the first repetition rate.

Clock generation for a photonic quantum computer comprising a photon-pair source to convert the converted electrical pulses into a plurality of clock signals at a first repetition rate

Aspects of the subject technology relate to a system including a reference device, a measurement device and a processor. The measurement device provides a three-dimensional (3-D) point map corresponding to first positions of a plurality of selected points on a torso of a user. The processor determines a shape of the torso based on the 3-D point map. The measurement device is sequentially placed on the plurality of selected points, and the 3-D point map represents the first positions of the plurality of selected points relative to a second position associated with a location in 3-D space of the reference device.

Body volume/shape determination using handheld devices

A photon source module includes a plurality of photon sources, wherein each photon source is configured to non-deterministically generate one or more non-entangled or entangled photons in response to receiving a trigger signal. When two or more photon sources simultaneously generate photons in response to a trigger signal, one photon of a first photon pair is directed to a photon processing system and one photon of a second photon pair is directed to a photon analyzer. During repetitive operation, the photon analyzer analyzes photons from each of the plurality of photon sources to determine characteristics of each photon source and can use that information to direct the highest quality photons to the photon processing system.

Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

Quantum computing die assembly with thru-silicon vias

Photonic quantum computer assembly having dies with specific contact configuration and matched CTE

Quantum computing die assembly with thru-silicon vias and connected logic circuit

Clock generation for a photonic quantum computer to convert electrical pulses into a plurality of clock signals

Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.

Stackable passive component

Growing community of inventors

Sunnyvale, CA, United States of America

Albert Wang