Taiwan Semiconductor Manufacturing Comp. Ltd.

Albert Wan

Chao-Wen Shih

Han-Ping Pu

Shou-Zen Chang

Yu-Sheng Hsieh

Ching-Hua Hsieh

Yung-Ping Chiang

Hsin-Yu Pan

Sen-Kuei Hsu

Chuei-Tang Wang

Chung-Hao Tsai

Chien-Ling Hwang

Nan-Chin Chuang

Chen-Hua Douglas Yu

Chung-Shi Liu

Kai-Chiang Wu

Pei-Hsuan Lee

Tzu-Chun Tang

Sheng-Hsiang Chiu

Yu-Ting Chiu

Jui-Chang Kuo

Meng-Tse Chen

Chi-Ming Huang

Chun-Lin Lu

Shou Zen Chang

Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Semiconductor packages and manufacturing methods thereof

A semiconductor device including a chip package, a dielectric structure, and a first antenna pattern is provided. The dielectric structure is disposed on the chip package and includes a cavity and a vent in communication with the cavity. The first antenna pattern is disposed on the dielectric structure, wherein the chip package is electrically coupled to the first antenna pattern, and the cavity of the dielectric structure is disposed between the chip package and the first antenna pattern.

Semiconductor device having antenna and manufacturing method thereof

Semiconductor device having antenna on chip package and manufacturing method thereof

A semiconductor package includes a semiconductor chip and a redistribution layer structure. The redistribution layer structure is arranged to form an antenna transmitter structure and an antenna receiver structure over the semiconductor chip, wherein patterns of the antenna receiver structure are located at different levels of the redistribution layer structure, and at least one pattern of the antenna transmitter structure is at the same level of the topmost patterns of the antenna receiver structure.

A package structure include a ground plate, a semiconductor die, a molding compound, and an antenna element. The semiconductor die is located over the ground plate. The molding compound is located over the semiconductor die. The antenna element is located in the molding compound and overlaps with the ground plate along a stacking direction of the ground plate, the semiconductor die and the molding compound. The antenna element has a first side levelled with a first surface of the molding compound, and the ground plate is located between the semiconductor die and the antenna element.

Package structure and manufacturing method thereof

A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A core layer and a dielectric layer are sequentially stacked over the package array. The core layer includes a plurality of cavities. A plurality of first conductive patches is formed on the dielectric layer above the cavities.

Integrated fan-out package and manufacturing method thereof

A package structure in accordance with some embodiments may include an RFIC chip, a redistribution circuit structure, a backside redistribution circuit structure, an isolation film, a die attach film, and an insulating encapsulation. The redistribution circuit structure and the backside redistribution circuit structure are disposed at two opposite sides of the RFIC chip and electrically connected to the RFIC chip. The isolation film is disposed between the backside redistribution circuit structure and the RFIC chip. The die attach film is disposed between the RFIC chip and the isolation film. The insulating encapsulation encapsulates the RFIC chip and the isolation film between the redistribution circuit structure and the backside redistribution circuit structure. The isolation film may have a coefficient of thermal expansion lower than the insulating encapsulation and the die attach film.

Package structure and method of fabricating package structure

A semiconductor device including a chip package and an antenna package disposed on the chip package is provided. The chip package includes a semiconductor chip, an encapsulation enclosing the semiconductor chip, and a redistribution structure disposed on the semiconductor chip and the encapsulation and electrically coupled to the semiconductor chip. The antenna package includes an antenna pattern electrically coupled to the chip package, and an intermediate structure disposed between the antenna pattern and the chip package, wherein the intermediate structure comprises a ceramic element in contact with the redistribution structure and thermally dissipating a heat generated from the semiconductor chip.

Semiconductor device and manufacturing method thereof

A semiconductor package, a semiconductor device and a method for packaging the semiconductor device are provided. A semiconductor package includes a first conductive wire layer with a first mounting area and a second mounting area, an integrated circuit (IC), a radiation fin structure and an antenna. The first mounting area and the second mounting area do not overlap. The IC is disposed on a first surface of the first mounting area. The radiation fin structure is disposed on a second surface of the first mounting area. The antenna is disposed on the second mounting area.

Semiconductor package, semiconductor device and method for packaging semiconductor device

A method of manufacturing an integrated fan-out (InFO) package includes at least the following steps. A package array is formed. A dielectric layer having a core layer formed thereon is provided. The core layer includes a plurality of cavities penetrating through the core layer. The dielectric layer and the core layer are attached onto the package array such that the core layer is located between the dielectric layer and the package array. A plurality of first conductive patches is formed on the dielectric layer above the cavities.

Method of manufacturing integrated fan-out package

A semiconductor device including a chip package, a dielectric structure and a first antenna pattern is provided. The dielectric structure disposed on the chip package and includes a cavity and a vent in communication with the cavity. The first antenna pattern disposed on the dielectric structure, wherein the chip package is electrically coupled to the first antenna pattern, and the cavity of the dielectric structure is disposed between the chip package and the first antenna pattern. A manufacturing method of a semiconductor device is also provided.

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Hsinchu, Taiwan

Albert Wan