Lucent Technologies Inc.

Albert W Robinson

Kon Mang Lin

Quentin D Groves

An improved robber or solder thieving pad, parallelogram shaped, significantly reduces solder bridging in wave soldered multi leaded through hole or surface mounted components in a printed circuit board for different wave settings. The component leads are either parallel or perpendicular to the solder wave during the soldering process. In one embodiment, the parallelogram shaped solder thieving pad is disposed contiguous or adjacent to the through hole. In another embodiment, the parallelogram shaped solder thieving pad is spaced from a thin annular ring surrounding the through-hole. In still another embodiment, the pad may be linked to the ring by a thin connecting bridge. Dimensions of the solder thieving pad vary according to the component lead size, spacing, and number of rows. The design of the pad takes into account the total molten solder volume held in a solder joint and balances the weight of the solder volume, the dynamic solder flow in the wave; and the solder surface tension for improving the drainage behavior of the solder to inhibit solder bridging of the component leads.

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Oklahoma City, OK, United States of America

Albert W Robinson