Lumentum Operations LLC

Hewlett-packard Company

Agilent Technologies, Inc.

Emcore Corporation

Other

Avago Technologies Fiber IP Pte Ltd.

Alvesta Corporation

Albert T Yuen

Ajit Vijay Barve

Scott W Corzine

Michael R Tan

Shih-Yuan Wang

Paul Kessler Rosenberg

Kirk S Giboney

Tao Zhang

Eric R Hegblom

Leif Eric Larson

David M Sears

Michael R T Tan

William David Holland

Dubravko I Babic

Richard R Baldwin

John Phillip Ertel

Lakshman Rathnam

Pierre H Mertz

Xiaozhong Wang

Guowei Zhao

Yu-Min Houng

Howard Huang

Edmond Lau

Ghulam Hasnain

Chien-Yao Lu

Pengfei Qiao

Chun Lei

Mitchell Srimongkol

Joseph Lin

A vertical cavity surface emitting laser (VCSEL) may include a substrate layer, epitaxial layers on the substrate layer, and angled reflectors configured to receive an optical beam emitted toward a bottom surface of the VCSEL and redirect the optical beam through an exit window in a top surface of the VCSEL. In some implementations, the angled reflectors may be formed in the substrate layer. Additionally, or alternatively, the VCSEL may include molded optics, where the molded optics include the angled reflectors. In some implementations, the exit window may include an integrated lens.

Top-emitting vertical-cavity surface-emitting laser with bottom-emitting structure

An emitter may include a substrate, a conductive layer on at least a bottom surface of a trench, and a first metal layer to provide a first electrical contact of the emitter on an epitaxial side of the substrate. The first metal layer may be within the trench such that the first metal layer contacts the conductive layer within the trench. The emitter may further include a second metal layer to provide a second electrical contact of the emitter on the epitaxial side of the substrate, and an isolation implant to block lateral current flow between the first electrical contact and the second electrical contact.

Vertical-cavity surface-emitting laser with dense epi-side contacts

An apparatus may include an upper transparent plate to hold a wafer of bottom-emitting or bottom-detecting optical devices, wherein the upper transparent plate comprises a set of holes in an area of the upper transparent plate for holding the wafer. The apparatus may include a lower transparent plate and a structure supporting the upper transparent plate and the lower transparent plate to form a cavity bounded by the upper transparent plate, the lower transparent plate, and the structure, wherein the structure comprises an opening in fluid communication with the cavity, wherein applying suction through the opening, via the cavity and the set of holes, holds the wafer flat on the upper transparent plate, and wherein an optical path, between a bottom-emitting or bottom-detecting optical device of the bottom-emitting or bottom-detecting optical devices of the wafer and a testing device, passes through the upper transparent plate, the cavity, and the lower transparent plate.

Testing apparatus for optical devices

In some implementations, an optical device for mounting in a flip-chip configuration includes a plurality of flip-chip bumps that are arranged in a pattern on the optical device, wherein the pattern is not aligned with a crystal cleavage plane associated with a substrate of the optical device. In some implementations, the optical device further includes a gap that separates a primary region of the optical device and a secondary region of the optical device, wherein at least one portion of a side of the gap is oriented at a non-zero angle to the crystal cleavage plane.

Angled flip-chip bump layout

An emitter array may comprise a plurality of emitters that includes two adjacent emitters. The emitter array may comprise a plurality of emitters that includes two adjacent emitters. The ohmic metal layer may include a portion that is shared by, and located between, the two adjacent emitters. The emitter array may comprise a protective layer over the ohmic metal layer. The emitter array may comprise a via through the protective layer to the portion. The via is shared by, and located between, the two adjacent emitters.

Emitter array with shared via to an ohmic metal shared between adjacent emitters

A vertical-cavity surface-emitting laser (VCSEL) may include a substrate and a set of epitaxial layers on the substrate. The set of epitaxial layers may include a first mirror and a second mirror, an active region between the first mirror and the second mirror, and an oxidation layer to provide optical and electrical confinement in the VCSEL. The oxidation layer may be near the first mirror. The set of epitaxial layers may include an oxide lens to control a characteristic of an output beam emitted by the VCSEL. The oxide lens may be separate from the oxidation layer, and may be a lens that is separate from the first mirror and from the second mirror.

Distributed oxide lens for beam shaping

A vertical cavity surface emitting laser (VCSEL) may include a top contact, wherein the top contact is associated with a particular shape, and wherein the particular shape is a toothed shape with a particular quantity of teeth. The VCSEL may include at least one implanted region. The VCSEL may include at least one top contact segment.

Vertical cavity surface emitting laser mode control

A surface emitting laser may include an isolation layer including a first center portion and a first plurality of outer portions extending from the first center portion, and a metal layer including a second center portion and a second plurality of outer portions extending from the second center portion. The metal layer may be formed on the isolation layer such that a first outer portion, of the second plurality of outer portions, is formed over one of the first plurality of outer portions. The surface emitting laser may include a passivation layer including a plurality of openings. An opening may be formed over the first outer portion. The surface emitting laser may include a plurality of oxidation trenches. An oxidation trench may be positioned at least partially between the first outer portion and a second outer portion of the second plurality of outer portions.

Compact emitter design for a vertical-cavity surface-emitting laser

In some implementations, a vertical cavity surface emitting laser (VCSEL) includes a substrate layer and epitaxial layers on the substrate layer. The epitaxial layers may include an active layer, a first mirror, a second mirror, and one or more oxidation layers. The active layer may be between the first mirror and the second mirror, and the one or more oxidation layers may be proximate to the active layer. The one or more oxidation layers may be configured to control beam divergence of a laser beam emitted by the VCSEL based on at least one of: a quantity of the one or more oxidation layers, a shape of the one or more oxidation layers, a thickness of the one or more oxidation layers, or a proximity of the one or more oxidation layers to the active layer.

Controlling beam divergence in a vertical-cavity surface-emitting laser

A device includes a substrate, a first vertical cavity surface emitting laser (VCSEL) array on the substrate, a second VCSEL array on the substrate and adjacent to the first VCSEL array, and an isolation structure between the first VCSEL array and the second VCSEL array. The isolation structure provides electrical isolation between the first VCSEL array and the second VCSEL array.

Electrically isolating vertical-emitting devices

A vertical cavity surface emitting laser (VCSEL) array may comprise a plurality of VCSELs, a plurality of structures extending from a surface of the VCSEL array, and one or more metallization layers electrically connecting to one or more VCSELs of the plurality of VCSELs. The one or more metallization layers may include portions over the plurality of structures. The portions over the plurality of structures may extend to a height that is greater than other features on the surface of the VCSEL array. When the VCSEL array is on a submount, the plurality of structures may mechanically support the VCSEL array and to prevent the other features on the surface of the VCSEL array from contacting the submount.

Emitter array having structure for submount attachment

A testing device for bottom-emitting or bottom-detecting optical devices may comprise a support structure to support a lower transparent chuck and an upper transparent chuck that includes a set of vacuum holes. In some implementations, a vacuum may be formed in a space between the lower transparent chuck and the upper transparent chuck when a vacuum pump is applied to an opening in a sidewall of the support structure. For example, the vacuum may create suction to cause an optical device under test to be mechanically secured on a top surface of the upper transparent chuck. The testing device may further comprise a photodetector disposed below the lower transparent chuck to detect light that travels through the upper transparent chuck and the lower transparent chuck when one or more probes complete an electrical path that causes the optical device under test to emit the light.

Testing device for bottom-emitting or bottom-detecting optical devices

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Los Altos, CA, United States of America

Albert T Yuen