Xilinx, Inc.

Albert Shih-Huai Lin

Amitava Majumdar

Niravkumar Patel

Henley Liu

Myongseob Kim

Nui Chong

Cheang-Whang Chang

Jane W Sowards

Rambabu Nerukonda

Partho Tapan Chaudhuri

An integrated circuit (IC) chip device includes testing interface circuity and testing circuitry to test the operation of the IC chips of the IC chip device. The IC chip device includes a first IC chip that comprises first testing circuitry. The first testing circuitry receives a mode select signal, a clock signal, and encoded signals, and comprises finite state machine (FSM) circuitry, decoder circuitry, and control circuitry. The FSM circuitry determines an instruction based on the mode select signal and the clock signal. The decoder circuitry decodes the encoded signals to generate a decoded signal. The control circuitry generates a control signal from the instruction and the decoded signal. The control signal indicates a test to be performed by the first testing circuitry.

Integrated circuit chip testing interface with reduced signal wires

An integrated circuit includes an intellectual property core, scan data pipeline circuitry configured to convey scan data to the intellectual property core, and scan control pipeline circuitry configured to convey one or more scan control signals to the intellectual property core. The integrated circuit also includes a wave shaping circuit configured to detect a trigger event on the one or more scan control signals and, in response to detecting the trigger event, suppress a scan clock to the intellectual property core for a selected number of clock cycles.

Hybrid synchronous and asynchronous control for scan-based testing

A semiconductor device comprises a plurality of memory elements, test control circuitry, and a testing interface. The test control circuitry is configure to determine that one or more clock signals associated with the memory elements have been stopped and generate a scan clock signal based on the determination that the one or more clock signals have been stopped. The test control circuitry is further configured to communicate the scan clock signal to the memory elements. The testing interface is configured to communicate test data from the memory elements. In one example, the test data is delimited with start and end marker elements. The semiconductor device is mounted to a circuit board and is communicatively coupled to communication pins of the circuit board.

Testing memory elements using an internal testing interface

A circuit architecture for expanded design for testability functionality is provided that includes an Intellectual Property (IP) core for use with a design for an integrated circuit (IC). The IP core provides an infrastructure harness circuit configured to control expanded design for testability functions available within the IC. An instance of the IP core can be included in a circuit block of the design for the IC. The infrastructure harness circuit can include an outward facing interface configured to connect to circuitry outside of the circuit block and an inward facing interface configured to connect to circuitry within the circuit block. The instance of the IP core can be parameterized to configure the infrastructure harness circuit to control a plurality of functions selected from the expanded design for testability functions based on a user parameterization of the instance of the IP core.

Circuit architecture for expanded design for testability functionality

Device(s) and method(s) related generally to a wafer or die stack are disclosed. In one such device, a die stack of two or more integrated circuit dies has associated therewith test circuits corresponding to each level of the die stack each with a set of pads. A test data-input path includes being from: a test data-in pad through a test circuit to a test data-out pad of each of the test circuits; and the test data-out pad to the test data-in pad between consecutive levels of the test circuits. Each of the set of pads includes the test data-in pad and the test data-out pad respectively thereof. A test data-output path is coupled to the test data-out pad of a level of the levels.

Growing community of inventors

Mountain View, CA, United States of America

Albert Shih-Huai Lin