Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Oskam Oled Gmbh

Albert Schneider

Tony Albrecht

Thomas Schlereth

Michael Bestele

Tobias Gebuhr

Stephan Kaiser

Christian Gaertner

Harald Jaeger

Markus Kirsch

Herbert Brunner

Dominik Eisert

Michael Zitzlsperger

Markus Pindl

Karlheinz Arndt

Angela Eberhardt

Jan Marfeld

Martin Brandl

Ales Markytan

Hans-Christoph Gallmeier

Roland Schulz

Thomas Zeiler

Harald Jäger

Florian Peskoller

Jörg Frischeisen

Christian Gärtner

Thomas Huckenbeck

Jürgen Bauer

Michael Schmidberger

Peter Holzer

Stefan Handl

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a semiconductor layer sequence having an active region configured to emit radiation at least via a main radiation exit surface during operation and a self-supporting conversion element arranged in a beam path of the semiconductor layer sequence, wherein the self-supporting conversion element includes a substrate and subsequently a first layer, wherein the first layer includes at least one conversion material embedded in a matrix material, wherein the matrix material includes at least one condensed sol-gel material, wherein the condensed sol-gel material has a proportion between 10 and 70 vol % in the first layer, and wherein the substrate is free of the sol-gel material and the conversion material and mechanically stabilizes the first layer.

Optoelectronic component and method for producing an optoelectronic component

The invention relates to a method for producing a plurality of optoelectronic components, comprising the following steps: &#x2014;providing an auxiliary support wafer () having contact structures (), wherein the auxiliary support wafer comprises glass, sapphire, or a semiconductor material, &#x2014;applying a plurality of radiation-emitting semiconductor bodies () to the contact structures (), &#x2014;encapsulating an least the contact structures () with a potting mass (), and &#x2014;removing the auxiliary support wafer (). The invention further relates to an optoelectronic component.

Method for producing a plurality of optoelectronic components and optoelectronic component

In one embodiment, the method is configured for producing optoelectronic semiconductor components () and includes the steps of:

Method for producing optoelectronic semiconductor components, leadframe assembly and optoelectronic semiconductor component

An optoelectronic component device includes a plurality of optoelectronic components that provide and/or absorb electromagnetic radiation; a reflector arranged in a beam path of the electromagnetic radiation of the plurality of optoelectronic components and which has a surface that is at least partly reflective with respect to the provided electromagnetic radiation; wherein the plurality of optoelectronic components at least partly surround the reflector or are at least partly surrounded by the reflector; and the reflector reflects a provided electromagnetic radiation such that a predefined field distribution of the reflected electromagnetic radiation is formed in the image plane of the optoelectronic component device.

Optoelectronic component device, method of producing an optoelectronic component device, and method of operating an optoelectronic component device, method of operating an optoelectronic device having improved emission characteristics

A ring light module having a plurality of optoelectronic semiconductor components for producing electromagnetic radiation, a reflector of the ring light module comprising a reflective surface, and a support. The semiconductor components are mounted on the support. In a plan view of a main radiation side of the ring light module, the reflector comprises at most two planes of symmetry. The reflector tapers in the direction towards the main radiation side. At least some of the main emission directions of adjacent optoelectronic semiconductor components are oriented differently from each other, and the main emission directions point towards the reflective surface.

Ring light module

An optoelectronic semiconductor device includes a first light source that emits green, white or white-green light and includes a semiconductor chip that emits in the blue spectral range, and a first conversion element attached directly to the semiconductor chip, a second light source that emits red light, having a semiconductor chip, that emits in a blue spectral range, and having a second conversion element attached directly to the semiconductor chip, and/or having a semiconductor chip that emits in a red spectral range, a third light source that emits blue light and has a semiconductor chip emitting in the blue spectral range, and a filler body having a matrix material into which a conversion agent is embedded, wherein the filler body is disposed downstream of the light sources collectively.

Optoelectronic semiconductor device

A leadframe for producing a number of optoelectronic components is specified. At least one mounting region includes a number of chip mounting areas for a number of semiconductor chips. Alongside the mounting region at at least one main area of the leadframe one or more of grooves for reducing mechanical stresses in the leadframe are formed. The groove(s) do not completely penetrate through the leadframe. A method for producing a number of optoelectronic components on a leadframe of this type is furthermore specified.

Leadframe for optoelectronic components and method for producing optoelectronic components

An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.

Optoelectronic component and method for producing an optoelectronic component and a compound structure

A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

Method for the manufacture of an optoelectronic component and an optoelectronic component

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Thalmassing, Germany

Albert Schneider