Corning Incorporated

Corning Glass Works

Albert Roth Nieber

Sergio Tsuda

Dana Craig Bookbinder

Pushkar Tandon

Stephan Lvovich Logunov

Garrett Andrew Piech

Robert Stephen Wagner

Sasha Marjanovic

Natesan Venkataraman

Kamjula Pattabhirami Reddy

Helmut Schillinger

Paul John Shustack

Lewis Kirk Klingensmith

Max R Montierth

Michael Albert Joseph, Ii

Charles Michael Darcangelo

Kristopher Allen Wieland

Larry G Mann

Jose Mario Quintal

Arthur E Hillman

Christopher Paul Daigler

John Charles Speeckaert

Nikki J Russo

Florian Spaeth

Thomas Hackert

Michael Klein

Frank Fabian Herrnberger

David R Fladd

Heather Nicole Vanselous

Andreas Simon Gaab

Jean-Luc Dabouineau

David G Cyr

David C Jenne

Marco Wolfert

Gary M Hazard

A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

Methods for separating transparent articles from a transparent mother sheet using an open ended pressure assembly

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

Substrate processing station for laser-based machining of sheet-like glass substrates

A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.

Apparatuses and methods for laser processing laminate workpiece stacks

The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a COlaser (coupled with high pressure air flow) for fully automated separation.

Laser cut composite glass article and method of cutting

The embodiments disclosed herein relate to methods, systems, and system components for creating and arranging small (micron and smaller) defects or perforations in transparent materials in a particular manner, and, more particularly, to the arrangement of these defects, each of which has an average crack length, in a predetermined spaced-apart relation (each defect separated from an adjacent defect by a predetermined distance) defining a contour in a transparent material to lower the relative interface fracture toughness for subsequent planned induced separation.

Method and system for forming perforations

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a COlaser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or COlasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

Edge chamfering methods

A system for levitating a softened, viscous or viscoelastic material by near field acoustic levitation. The system includes a support structure having a rigid surface, and a vibration generator operatively connected to the rigid surface. The vibration generator transmits acoustic waves to the rigid surface at a frequency and an amplitude sufficient to vibrate the rigid surface and create a gas squeeze film between the material and the rigid surface. The gas squeeze film has a pressure greater than ambient air pressure and sufficient to levitate the material. The system is particularly suited for transporting, forming, or casting heated glass. Also disclosed are methods for transporting, forming, and casting heated glass using near field acoustic levitation.

Ultrasonic near field hot glass transportation and forming

Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla&#xae; glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a COlaser for fully automated separation.

Processing 3D shaped transparent brittle substrate

A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (), an induced absorption within the transparent material in order to produce a defect () in the transparent material.

Method and system for arresting crack propagation

Methods of fabricating formed glass articles are described herein. In one embodiment, a method for fabricating a formed glass article may include forming a glass ribbon, forming a parison, and shaping the parison to form a glass article. The glass article may be attached to the glass ribbon at an attachment region defining an edge of the glass article. The process may also include contacting the attachment region with a focal line of a laser beam and separating the glass article from the glass ribbon at the attachment region. The attachment region may be perforated by the laser beam and the focal line may be substantially perpendicular to the plane of the glass ribbon.

Methods and apparatuses for fabricating glass articles

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of &#x3e;1 m/sec, to cut sharp radii outer corners (&#x3c;1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.

Laser cutting of display glass compositions

Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.

Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles

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Painted Post, NY, United States of America

Albert Roth Nieber