Labinal Components and Systems, Inc.

Albert N Hopfer, Iii

Richard J Lindeman

Edward M Allard

Arun J Shah

Saeed U Zafar

Richard J Linderman

David W McClung

Apparatus and methods for facilitating insertion and maximizing resiliency, reliability and conductivity of button contacts in button board type circuit interconnectors.

Electrical interconnects

A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier comprises a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

Socket assembly for electrical component

A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier includes a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

Socket assembly for integrated circuit chip package

A thermal transfer plate for removing heat to a heat sink or cooling fins positioned between an electrical component and a mounting surface. The plate comprises a heat conductive material which is in thermal communication with the electrical component and extends beyond the electrical component to establish thermal communication with a heat sink or cooling fins. In one specific embodiment, the thermal transfer plate has a base portion with upright side walls which form a socket to receive the electrical component. Horizontal cooling fins are located at the top of the sidewalls. The cooling fins can be of any shape which will perform the cooling or heat sink function and can be made with openings which permit air to circulate through the cooling fins. Moreover, due to its efficient heat transfer capabilities, the thermal transfer plate could be thermally connected to a separate heat sink device.

Thermal transfer plate and integrated circuit chip or other electrical

A novel wadded wire-plunger contact is provided which possesses excellent durability and desired functional characteristics in a large variety of applications such as the testing of IC chips.

Growing community of inventors

Park Ridge, IL, United States of America

Albert N Hopfer, Iii