Hoya Corporation USA

Xponent Photonics Inc

Mellanox Technologies Silicon Photonics Inc.

Albert Michael Benzoni

Henry A Blauvelt

Joel S Paslaski

Peter C Sercel

Rolf Andreas Wyss

David W Vernooy

Amir Ali Tavallaee

Gerald C Byrd

Mark E Temple

Mark D Downie

Bhavin Bijlani

An optical system includes a laser die that includes a gain medium and multiple laser waveguides that are each configured to guide a different laser light signal through the gain medium. Each of the laser waveguides outputs a laser light signal at a wavelength. The laser waveguides are arranged in multiple candidate groups. Each candidate group includes multiple laser waveguides. The wavelength spacing of the laser waveguides is the same or substantially the same in different candidate groups.

Increasing accuracy in the wavelength of semiconductor lasers

A method comprises: receiving an RF signal; providing an RF signal level; setting a DC optical power level at one of at least two levels depending on whether the RF signal level is above or below an RF threshold; and modulating with the RF signal optical output power about the DC optical power level. An apparatus comprises: a light source; an RF detector arranged to receive the RF signal and to provide the RF signal level; an optical power control circuit coupled to the RF detector and to the light source that includes a comparator and is arranged to set the DC optical power level according to the RF signal level; and an optical modulator coupled to the light source and arranged to receive the RF signal and to modulate therewith optical output power about the DC set point.

Light source for a passive optical network

An optical element comprises a substantially transparent material having opposing first and second transmission surfaces and a substantially flat mounting surface between them, an alignment mark, and an optical coating. The optical element is mounted self-supporting on a substrate with the mounting surface on a mating portion thereof. With the alignment mark aligned to a corresponding mark on the substrate, waveguides on the substrate can be end-coupled by reflection from the first transmission surface. The transmission and mounting surfaces are arranged to position the transmission surfaces at respective orientations relative to the substrate surface so that an optical beam propagating substantially parallel to the substrate surface and entering the optical element through the first transmission surface propagates as an optical beam through the optical element above the mounting surface and exits the optical element through the second transmission surface. The optical element can further include a lens or an aperture.

Optical element for free-space propagation between an optical waveguide and another optical waveguide, component, or device

A segment of optical fiber is engaged with a fiber groove on a device substrate, which positions the fiber segment for optical coupling with an optical component on the substrate. A fiber retainer maintains the fiber segment in engagement with the groove. The fiber retainer may be secured to the substrate with adhesive means. The adhesive means forms at least one retaining member that at least partially fills at least one recessed region formed on the device substrate or on the fiber retainer. That recessed region is spatially separate from the fiber groove and from an area of the fiber retainer engaged with the fiber.

Packaging for a fiber-coupled optical device

An optical apparatus comprises: an optical fiber, an optical device on a substrate, a circuit board, and an electrical connection therebetween. The substrate has a groove for positioning the fiber for optical coupling with the optical device. A proximal segment of the fiber is secured to the substrate in the groove. The substrate is mounted on the circuit board, and a second segment of the fiber is secured to the circuit board. A method comprises: mounting on the circuit board the substrate with the optical device; establishing the electrical connection; securing the proximal fiber segment to the substrate in the groove; and securing the second fiber segment to the circuit board. Multiple substrates can be secured to a single piece of circuit board material, which can be divided into individual circuit boards after establishing electrical connections and securing optical fibers to the corresponding substrates and to the circuit board material.

Fiber-coupled optical device mounted on a circuit board

An optical device assembly comprises a substrate with a component and fiber groove thereon. A segment of optical fiber is engaged with the fiber groove, which positions the fiber segment for optical coupling with a component on the substrate. A fiber retainer maintains the fiber segment in engagement with the groove. The fiber retainer may be secured to the substrate with adhesive means. Recessed regions formed on the substrate/retainer are filled with adhesive means, forming retaining members. Alternatively, the fiber retainer comprises a resilient member engaged with the device substrate and biased so as to urge the fiber segment into the groove. The resilient member may be variously configured and/or adapted for enhancing engagement of the fiber segment with the fiber groove. Either embodiment may include a housing, which may be variously configured and/or adapted for engaging a mating fiber-optic connector, providing fiber pigtail(s), mechanical splicing, and so forth.

A method for micro-hermetic packaging of an optical device comprises: forming a micro-hermetic cavity on a substrate; providing a transmission optical waveguide transferring optical power between the interior and the exterior of the micro-hermetic cavity; fabricating or mounting at least one optical device within the micro-hermetic cavity; enabling optical power transfer between the optical device and the transmission optical waveguide; and sealing the optical device within the micro-hermetic cavity. The micro-hermetic cavity may be fabricated of a size comparable to the optical device, and many such cavities may be simultaneously fabricated on a single substrate using wafer-scale processing. The transmission optical waveguide, electrical feed-throughs, and/or other monitoring/controlling components may be provided with the micro-hermetic cavity on the same substrate, or as a separate component and/or on a separate substrate. Alternatively, the optical device, transmission optical waveguide, and any other associated components may be embedded in transparent material for hermetic sealing.

Micro-hermetic packaging of optical devices

A packaged fiber-coupled optical device comprises an alignment housing with a fiber retainer, optical fiber segment(s), and optical component(s) (on substrate(s) with fiber groove(s)). Upon assembly the protruding end(s) of the fiber segment(s) is/are positioned against the fiber retainer, and the fiber groove(s) is/are aligned with the protruding end(s) of the fiber segment(s). The fiber retainer urges the protruding end(s) of the fiber segment(s) into the fiber groove(s). The fiber groove(s) position the protruding end(s) of the optical fiber(s) seated therein for optical coupling with optical component(s). The alignment housing and/or a fiber subassembly may be configured for engaging a mating fiber-optic connector.

A recessed area formed on a substrate surface is filled with heat sink material to form a heat sink. The heat sink material has thermal conductivity greater than that of the substrate. The heat sink may have a substantially flat surface substantially flush with the substrate surface. The substrate may further include: a planar optical waveguide formed thereon positioned for optical coupling with an optical device mounted on the substrate in thermal contact with the heat sink; and/or an electrical contact layer formed thereon positioned for establishing electrical continuity with an optical device mounted on the substrate in thermal contact with the heat sink. The electrical contact may also provide thermal contact between the device and heat sink. The substrate may further include a low-index optical buffer layer formed on its surface. Materials for the substrate, buffer layer, and heat sink may include silicon, silica, and diamond, respectively.

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South Pasadena, CA, United States of America

Albert Michael Benzoni