Utac Headquarters Pte. Ltd.

Utac Dongguan Ltd.

Albert Loh

Saravuth Sirinorakul

Suebphong Yenrudee

Keith M Edwards

Serafin Padilla Pedron, Jr

Edward Then

Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing circuit is formed from multiple leadframe routing layers in a plated and etched copper terminal semiconductor package by removing unwanted areas of each leadframe to create conductive paths on an associated leadframe layer of the semiconductor package.

Semiconductor package with multiple stacked leadframes and a method of manufacturing the same

Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.

Thermal leadless array package with die attach pad locking feature

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Fremont, CA, United States of America

Albert Loh