Apack Technologies Inc.

Lite-on Technology Corporation

Albert Lin

Chong-Ren Maa

Jin-Chyuan Biar

Sam Chiang

A method for adjusting image contrast has the steps of constructing a luminance histogram of an original image; acquiring an image characteristic of the luminance histogram; judging whether there is a peak wave or deviation of luminance existed in that image characteristic; determining a control point after performing a specific algorithm; deriving a linear equation from the control point and a contrast adjusting value in a Cartesian coordinate system; establishing a gamma table from the correspondent relationship between the horizontal and vertical axis in the coordinate, where the relationship can be calculated according to the linear equation; and finally generating a luminance value from the gamma look-up table using the input luminance of each pixel in the original image.

Method for adjusting image contrast

A packaging method for integrated circuit device, which is fit to apply flip chip bonding technique to a leadframe-type chip carrier. The packaging method will not increase the difficulty in assembly of the integrated circuit chip with the leadframe and is able to ensure that the integrated circuit chip be assembled with the lead fingers of the leadframe without false soldering. Also, the packaging method can achieve less inductance of the transmission line and faster transmission speed. In addition, the cost required of the packaging method can be much lower than that for the organic or ceramic base board.

Flip clip bonding leadframe-type packaging method for integrated circuit device and a device formed by the packaging method

A hole is generated in a substrate. A chip is connected to the substrate by using the chip receiving area of the substrate by using flip chip assembly. The hole is aligned to the chip receiving area of the substrate. Then, a underfill process is performed such that the space between the chip and the substrate will be encapsulated using liquid capsulated material. The liquid capsulated material is injected into the hole from the back side surface of the substrate to the front side surface of the substrate.

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Taipei, Taiwan

Albert Lin