Amazon Technologies, Inc.

Albert John Yu Sam Chua

Bernhard Wildner

Adrian Napoles

Sun Joo Han

Sarah Graber

Ulf Jan-Ove Mattsson

Felipe A Varela

Chia Hung Kuo

Duane Everard Whyte

Tony David

Giovanni Mata Magana

Christopher Mann Chamberlin

Jacob William Beatty

Adrian Roy Ramiscal Santos

Brad Nathaniel Arnold

Danny Chan

Adam Kenneth Cybart

Alexander David Savello

Thompson Quang-Tue Nguyen

Marc Rene Walliser

Aleksandar Pance

Omar Sze Leung

Carl Philip Taussig

Christopher C Jones

Wilfrido Loor Canizares

John Edwin Johnston

Troy Hulick

Matthew Michael Seflic

Ippei Matsumoto

Adam Barry Fineberg

Shelomon Patrick Doblack

Pushkaraksha Gejji

Bradley David Urban

Miguel Angel Morales

Christopher Lorenzo Dunn

Amita Pawar

Manish Avinash Mantrawadi

Jordan Pine

William James Carter-Giannini

Robert Olson

Allen David Minnehan

Gaurav Soni

Paul Leland Mandel

Stephen Anthony Kitchens

Daniel Jones

Nathan M Li

Matthew F Ardema

Yu-Tsen Kuo

Thompson Q Nguyen

Sacha Benjamin Holland

Charging clip

Electronic device charger

An audio device having a housing including a first loudspeaker disposed in the housing and oriented to emit sound towards a top of the housing, a second loudspeaker disposed in the housing and oriented to emit sound towards a bottom of the housing, and a third loudspeaker disposed in the housing and oriented to emit sound radially outward from the housing of the audio device. Embodiments may include a microphone array disposed proximate the top of the audio device and encircling the first loudspeaker.

Electronic device

Systems, methods, and computer-readable media are disclosed for voice activated devices with integrated heatsinks and speakers. In one embodiment, an example voice activated device may include a housing having an upper portion and a lower portion, a speaker housing, a heatsink coupled to the speaker housing, where the heatsink and the speaker housing together form a sealed chamber, a first speaker coupled to the speaker housing and partially disposed within the sealed chamber, where the first speaker is oriented to output audio towards the upper portion of the housing, and a light ring disposed about the lower portion of the housing.

Voice activated device with integrated heatsink and speaker

A robotic assistant comprises a plurality of sensors in a compact and unobtrusive form. One or more sensors may be emplaced upon a mast that may be selectively raised and lowered. The mast allows the robotic assistant to acquire images or other sensor data from a greater height, without substantially increasing the bulk of the robotic assistant. For ease of transport from one floor to another or from one building to another, the robotic assistant may deploy a handhold that a human may use to pick up and carry the robotic assistant. Floor characterization sensors may be used to determine characteristics of the floor such as if the floor is wet or dry. The robotic assistant may be used to provide a user with access to network services, to monitor a facility, provide telepresence services, and so forth.

Robotic assistant

Systems, methods, and computer-readable media are disclosed for voice activated devices with integrated heatsinks and speakers. In one embodiment, an example voice activated device may include a housing having an upper portion and a lower portion, a speaker housing coupled to the lower portion, where the speaker housing and the lower portion together form a sealed chamber, a heatsink coupled to the lower portion and disposed in the sealed chamber, and a first speaker coupled to the speaker housing and partially disposed within the sealed chamber, where the first speaker is oriented to output audio towards the upper portion of the housing.

Ring-shaped electronic device

Systems, methods, and computer-readable media are disclosed for ring-shaped devices with voice integration. In one embodiment, an example device may include an antenna element that at least partially forms an outer surface of the ring-shaped device, an outer shell coupled to the antenna element, an inner shell coupled to the outer shell, a curved battery disposed along a first side of the ring-shaped device, and a flexible printed circuit assembly coupled to the curved battery and disposed along a second side of the ring shaped device.

Ring-shaped devices with voice integration

A modular controller may be mounted in an opening, such as a standard single wide or double wide electrical junction box, in a wall or other surface. The modular controller may include a power module and a front module. The power module may be mounted in the opening of the surface, and may be configured to provide electrical power to the front module. The front module may be detachably coupleable to the power module. The front module may be configured to receive audio commands, gesture commands, and/or presence input corresponding to a desired action, and may cause the action to be performed by a device of the front module and/or an external device. The front module may include various devices (e.g., components) capable of providing various functionalities, and may be selected for coupling to a power module in a particular location based at least in part on the functionalities.

Voice activated modular controller

A portable audio input/output device may include an assembly enclosure that contains electrical and mechanical components of the device. A substantially cylindrical frame may encircle the assembly enclosure and may be surrounded by a tube of seamless material. A top end of the tube of seamless material may fold over a top end of the substantially cylindrical frame, and a bottom end of the tube of seamless material may fold over a bottom end of the substantially cylindrical frame. A cover assembly may couple to a top end of the assembly enclosure and secure the top end of the seamless fabric. A charging foot may be coupled to a bottom end of the assembly enclosure and secure the bottom end of the seamless fabric.

Electronic device with seamless fabric assembly

Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.

Unibody thermal enclosure

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San Jose, CA, United States of America

Albert John Yu Sam Chua