Flextronics Ap, LLC

Digital Optics Corporation

Albert John Y Chua

Lothar R Westerweck

Bahram Afshari

Abhijit Limaye

John W Toor

Elaine B Bogue

Dennis R Berube

The present invention relates to methods of manufacturing ultra-compact camera modules, adjusting them, post production, to precise focal point settings, and sealing the precisely aligned assembly to maintain the focal point. Also, the invention specifically relates to ultra-compact camera module apparatuses.

Camera module back-focal length adjustment method and ultra compact components packaging

A disclosed method of manufacturing a camera module includes providing an image capture device, providing an electronic component, providing a flexible circuit substrate, mounting the image capture device on a first portion of the flexible circuit substrate, mounting the electronic component on the second portion of the flexible circuit substrate, and positioning the second portion above the first portion. The method further includes providing a chip carrier including a bottom surface defining a cavity and a top surface adapted to receive the image capture device and positioning the chip carrier between the image capture device and the flexible circuit substrate. The method further includes mounting a second electronic component within the cavity.

Camera module with fold over flexible circuit and cavity substrate

A novel digital camera module includes an image capture device, a lens unit including a body, a housing including an opening for receiving the lens unit and positioning the lens unit with respect to the image capture device, and a contaminant trap formed by an isolated annular space between the lens unit and the opening of the housing. In a particular embodiment, the opening of the housing includes surfaces having at least two different perimeters, the smaller of which slidably engages the outer surface of the lens unit. The contaminant trap collects and contains any contaminants before they reach vulnerable components such as the image capture device and/or other optical components within the camera module.

Camera module with contamination reduction feature

A novel digital camera module includes an image capture device, a lens unit, a housing including an opening for receiving the lens unit and positioning the lens unit with respect to the image capture device, and a boot coupled the lens unit and the housing. In a particular embodiment, the boot includes an upper end and a lower end, each of which has a different outer perimeter. In another particular embodiment, a portion of the inner surface of the boot remains free of contact from the outer surface of the lens unit. In another particular embodiment, the lower end of the boot extends beyond the lower end of the lens unit.

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San Jose, CA, United States of America

Albert John Y Chua