Motorola Corporation

Semiconductor Components Industries, LLC

Albert J Laninga

James H Knapp

James Price Letterman, Jr

Cliff J Scribner

Michael John Seddon

Chee Hiong Chew

Joseph K Fauty

Brian A Webb

William F Burghout

Laura J Norton

David Charles Lehnen

Saat Shukri Embong

Boon Huat Lim

Joseph E Sauvageau

Timothy Lee Johnson

Martin J Briehl

Aik Chong Tan

Marjorie S Baxter

Kenneth Teik Kheong Low

Stefan M Dykert

Gilbert J Archibeque, Jr

Rodney D Purcell

Santhiragasen Al Sengram Pillay

Harold G Anderson

Kristin F Cocking

A semiconductor package ( ) with a die ( ) having die pads ( ) coupled to inner ends ( ) of interconnects ( ), the die ( ) and the interconnects ( ) are molded in mold compound ( ) with mounting surface ( ) and outer ends ( ) exposed. A semiconductor die has an interconnect surface opposite the mounting surface.

Semiconductor package and method for forming same

An optical coupler (60) includes of an optical connector (10) coupled to an optoelectric board (64). An optical fiber (50) is inserted into the optical connector (10). The optical fiber (50) is bent to an angle of approximately 90.degree. inside the optical connector (10). A tip (55) of the optical fiber (50) is substantially perpendicular to the optoelectric board (64) and aligned to an optical region of an optoelectric device (62) on the optoelectric board (64). A portion of the optical fiber (50) outside the optical connector (10) is substantially parallel to the optoelectric board (64). A fiber retainer (30) secures the optical fiber (50) to the optical connector (10).

Optical coupler and method for coupling an optical fiber to an

A flexible shelf (12) and a method for coupling a semiconductor chip (33) to a leadframe (23) using the flexible shelf (12). The flexible shelf (12) has a mounting portion (16), a flexible portion (17), and a leadframe support portion (18). The flexible shelf (12) is used in a wire bonding support assembly (10) to provide support for the leadframe (23) during wire bonding. The flexible portion (17) of the flexible shelf (12) flexes to increase thermal conductivity between a heater block (29) and the leadframe (23) during wire bonding.

Wire bonding support structure and method for coupling a semiconductor

An electronic component includes a substrate (301, 801), a leadframe (101, 601, 710) coupled to a first surface of the substrate (301, 801) and extending beyond the first surface and towards a second surface of the substrate (301, 801), and an electrically conductive layer coupled to the second surface and coplanar with a contact portion of the leadframe (101, 601, 710) where the leadframe (101, 601, 710) and the electrically conductive layer form a package around the substrate (301, 801).

Semiconductor package consisting of multiple conductive layers

A method of manufacturing a semiconductor component includes forming a vertical side seal for a runner in a first mold plate by mating a protrusion of the first mold plate with a protrusion of a second mold plate. As an encapsulating material is forced through the runner, the vertical side seal prevents an encapsulating material from leaking out of the edge of the runner.

Method of manufacturing a semiconductor component

Real time distance and pressure data of a plunger (35) relative to a mold compound is provided by a compensation assembly (29) in a mold press (10). The compensation assembly has a sliding block assembly (30) which moves substantially in the same direction as the plungers (35). The sliding block assembly (30) has pressure control cylinders (33) which limit the pressure plungers (35) can apply. If the pressure on the plungers (35) should exceed this limit, the plungers (35) retract towards the sliding block assembly (30). A sensor (37) is coupled between the sliding block assembly (30) and the plungers (35) to measure the distance the plungers have moved towards the sliding block assembly (30). In one application, the sensor (37) is formed from a linear voltage displacement transducer (LVDT) so the mold press (10) can have real time pressure and distance data.

Transfer molding press

A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) form cavities (20) that are filled with the material (21). The pins (13) are then extended from the cavity plate (16) to transfer the material (21) from the cavities (20) to the electronic component (32).

Material transfer apparatus and method of using the same

A method and apparatus for forming runners (47, 56) in a mold assembly (10, 50). The mold assembly (10, 50) has a cavity plate (11, 51) and a sealing plate (12, 52). The sealing plate (12, 52) has a sealing plate cavity (18) in which a resilient material (14) is placed. A floating seal (13) is movably mounted to the sealing plate (12) such that the floating seal (13) is on the resilient material (14). A workpiece (19) is placed on the resilient material (14) and the cavity plate (11, 51) is mated with the floating seal (13) thereby forming the runners (47, 56). The resilient material (14) imparts a force on the floating seal (13) and pushes the floating seal (13) against the cavity plate (11, 51) to prevent leakage of encapsulating material from the runners (47, 56).

Method and apparatus for forming a runner in a mold assembly

A dispenser (10, 32) that provides accurate control of the material dispensed has an upper adjuster (27) which is used to adjust the distance that the dispenser's (10, 32) plunger (23) is withdrawn from the dispenser's (10, 32) material reservoir (17), and a separate lower adjuster (28) to adjust the distance that the plunger (23) is inserted into the cavity (17) to dispense the material. The dispenser (10, 32) also includes a nozzle (16) and a nozzle plate (14, 14') that are formed from a dimensionally stable material in order to provide accurate control of the dispensing rate and the position of the nozzle. These features facilitate utilizing the dispenser (10, 32) as a portion of a multiple nozzle dispenser system (32) that accurately controls the rate at which material is emitted.

Accurately controlled fluid dispenser with upper and lower stroke

Two partial cylindrical, externally pressurized static air bearings are used to provide a self aligning air bearing platform. The self aligning air bearing platform is useful in a tape automated bonding system to bond a semiconductor device having a high pin count. A bottom bearing block has a top surface in the shape of an arc and at least one air outlet. A middle bearing block has a bottom surface configured to mate with the top surface of the bottom bearing block. The middle bearing block also has a top surface in a shape of an arc which is rotated 90.degree. with respect to the arc shaped top surface of the bottom bearing block and at least one air outlet. A top bearing block mates with the middle bearing block and provides the platform for holding the semiconductor device. Air bearings between the moving bearing blocks provide a low friction bearing for the aligning platform.

Self aligning air bearing platform

An automated curing oven system for use in the manufacturing of semiconductors. This system may easily be incorporated with other automated machinery used for various semiconductor processing steps because it employs the same device holding magazine used for many other steps. The device holding magazine serves as the oven chamber itself thereby eliminating many manual handling steps.

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Tempe, AZ, United States of America

Albert J Laninga