International Business Machines Corporation

Albert J Fahey

Gaetano Paolo Messina

Raed A Sherif

John Blake Pavelka

John Acocella

Steven P Young

Seaho Song

An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.

Apparatus for indirect impingement cooling of integrated circuit chips

Disclosed is a blind hole cold plate cooling system including:

Blind hole cold plate cooling system

Growing community of inventors

Pleasant Valley, NY, United States of America

Albert J Fahey