Rockley Photonics Limited

Albert Benzoni

Thomas Pierre Schrans

Aaron John Zilkie

Guomin Yu

Andrea Trita

Jacob Levy

Abu Thomas

Andrew George Rickman

Shuhe Li

Amit Singh Nagra

Chia-Te Chou

William Vis

Michael Lee

Melissa Ziebell

A system and method for alignment. In some embodiments, the method includes measuring a first offset, the first offset being an offset along a first direction between a first alignment mark and a second alignment mark, the first alignment mark being an alignment mark on a first edge of a source die, the second alignment mark being an alignment mark on a target wafer, and the first direction being substantially parallel to the first edge of the source die.

System and method for measuring alignment

An optoelectronic device. The device comprising: an input waveguide, which receives an optical signal; a multistage photodiode detector, comprising a plurality of photodiode elements connected in series, one of the photodiode elements of the plurality of photodiode elements being connected to the input waveguide and configured to receive the optical signal therefrom; and a first electrode and a second electrode, wherein the first electrode is connected to a first contact of each of the plurality of photodiode elements, and the second electrode is connected to a second contact of each of the plurality of photodiode elements.

Optoelectronic device

A photonic chip. In some embodiments, the photonic chip includes a waveguide; and an optically active device comprising a portion of the waveguide. The waveguide may have a first end at a first edge of the photonic chip; and a second end, and the waveguide may have, everywhere between the first end and the second end, a rate of change of curvature having a magnitude not exceeding 2,000/mm.

Optoelectronic device and array thereof

The present disclosure includes a method of securing a photonic component to a semiconductor chip, the method including forming a thermosonic bond between the semiconductor chip and a cap to fix the cap against the photonic component. The present disclosure also includes an apparatus including a semiconductor chip having a V-groove, an optical fiber in the V-groove, and a cap secured to the semiconductor chip through a bond including a metal bump, wherein the cap fixes the optical fiber in the V-groove.

Thermosonic bonding for securing photonic components

Growing community of inventors

South Pasadena, CA, United States of America

Albert Benzoni